Qualcomm Officially Announces Its Snapdragon 845 – 10nm Chip Paired With Latest X20 LTE Modem
It is finally here; the successor to the Snapdragon 835 and a competitor to the Exynos 9810, the Snapdragon 845 has been announced and is ready to be incorporated in devices like the Galaxy S9 and LG G7.
No Key Details Provided but Xiaomi CEO Hints at a Premium Smartphone That Will Be Sporting the Snapdragon 845
The Snapdragon 845 is expected to power the Galaxy S9 and LG G7, which has been rumored will be announced during January 2018. What is even more interesting is that a guest speaker also came on stage to talk about the company’s partnership with Qualcomm. That speaker was none other than Xiaomi’s founder and CEO, Lei Jun, who has stated that the Chinese manufacturer’s next premium smartphone will feature this SoC.
We can only assume that this premium smartphone is going to be called the Mi7, and it has been previously reported that Qualcomm and Xiaomi were working closely together to ensure that the chipset was optimized for the upcoming flagship. There are no other key details revealed about the Snapdragon 845 such as the processor support and other additions but it was reported that the chipset would feature the X20 LTE modem.
The modem would be capable of gigabit LTE speeds, though it will only be useful if carriers are actually able to provide such speeds for the public to experience. Previous leaks have shown that the Snapdragon 845 will provide support for the 802.11ad wireless standard, along with four ARM Cortex-A75 cores and four ARM Cortex-A53 cores which will be paired with the Adreno 630 GPU to exhibit impressive performance from Android flagships.
— Qualcomm (@Qualcomm) December 5, 2017
The Snapdragon 845’s successor, the Snapdragon 855 will most likely be manufactured on the 7nm FinFET process, hence the latest and greatest SoC’s lithography has been maintained at 10nm. Qualcomm will be announcing accurate details of the flagship chipset so stay tuned for more.
News Source: Twitter (Qualcomm)