tsmc

Google Taps MediaTek to Build TPUv9 "Triggerfish," Fusing CPU and Compute Die in One Package for Agentic AI

Google Taps MediaTek to Build TPUv9 “Triggerfish,” Fusing CPU and Compute Die in One Package for Agentic AI

Report: TSMC Follows Samsung and SK Hynix Into Price Surge, Catching Its Own Customers Off Guard With 7nm Hikes

TSMC Preps To Ramp Up Glass Substrate For NVIDIA In Race Against Intel & Samsung, First Chips To Drop By 2025-2026 1

TSMC and Intel Race to Replace Organic Substrates With Glass & Panel-Level Packaging, as a $650M Market Expected To Balloon Past $8 Billion by 2030

Samsung To Initiate Pilot Production Of Glass Substrates Semiconductor This Year

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%

Apple To Design & Build Chips At Intel on American Soil, US President Confirms

Apple To Design & Build Chips At Intel on American Soil, US President Confirms

TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant

Logos of 'Samsung' and 'tsmc' over a colorful semiconductor wafer background.

TSMC’s Steep 2nm Price Hikes Could Push NVIDIA and Apple Toward Samsung, as GAA Pricing Opens the Door

AI Chip Frenzy Drags Foundry Revenue Up 3.7% in Q1, Yet Wafer Prices Are About to Hit Customers Next

Japan's Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed

Japan’s Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed

NVIDIA’s Feynman AI Chip Poised to Break the CoWoS Size Barrier as TSMC Rushes CoPoS to 2028 Production – Analyst

TSMC's 3nm supply remains choked for AI customers

TSMC’s 3nm Wafer Supply Remains Constrained For AI Customers, Even After Monthly Production Reaches New Milestone Of 175,000 Units

Intel Nova Lake Desktop CPU Whispers: Early 2027 Launch, 52-Core Power/Thermal Details, Multi-Core Overclocking & Z990/Z970 Boards at Computex

Intel Nova Lake Desktop CPU Whispers: Early 2027 Launch, 52-Core Power/Thermal Details, Multi-Core Overclocking & Z990/Z970 Boards at Computex

AMD Ryzen 7 5800X3D 10th Anniversary Edition packaging on display with specifications including 8 cores, 16 threads, and 4.5 GHz max boost.

AMD Says It Had To Rebuild The Ryzen 7 5800X3D To Bring It Back For AM4’s 10th Anniversary

A close-up of an NVIDIA GPU alongside a TSMC wafer, with the text 'The World's Most Advanced GPU' displayed above.

TSMC Now Pays Its Biggest Customer NVIDIA, Pulling CUDA-X Into the Fab to Slash Lithography Costs by Up to 50%

Amazon has introduced its first discount on the MacBook Neo

TSMC’s CEO Urges Employees To Buy Its Shares While Apple Bleeds On MacBook Neo, As The Foundry’s 15% 3nm Price Hike Threatens To Push Margins Into Negative Territory

FuriosaAI Ditches GPU Playbook For 2nm Broadcom-Built Inference Chip, Claims HBM4/E Bandwidth Beats Even The Most Efficient GPUs

FuriosaAI Ditches GPU Playbook For 2nm Broadcom-Built Inference Chip, Claims HBM4/E Bandwidth Beats Even The Most Efficient GPUs

TSMC reportedly introducing price hike for 2nm wafers for four consecutive years

TSMC Scrambles To Calm Furious Employees With Promises Of Bigger Bonuses After CEO’s 30% Bonus Cut Comments Triggered Samsung-Style Revolt Fears

AMD's Next-Gen Zen 7 "Grimlock" CPUs To Utilize TSMC 1.4nm Process Tech & FOPLP Packaging, Launching in 2028

AMD’s Next-Gen Zen 7 “Grimlock” CPUs To Utilize TSMC 1.4nm Process Tech & FOPLP Packaging, Launching in 2028

NVIDIA's Jensen Huang & AMD's Lisa Su Touch Down in Taipei as Computex Showdown Looms, Showcasing Next-Gen Technologies

NVIDIA’s Jensen Huang & AMD’s Lisa Su Touch Down in Taipei as Computex Showdown Looms, Showcasing Next-Gen Technologies

Exynos 2700 can create a lot of trouble for Qualcomm and TSMC next year, if Samsung wants

Exynos 2700 Can Brew Trouble For Both TSMC And Qualcomm Next Year, But Samsung Has To Go The Extra Mile For That To Happen

TSMC has recorded 1.5x more tape-outs for its 2nm technology compared to the 3nm variant

TSMC Employees Are Exploding With Rage Over Rumored Bonus Cuts Despite A 58% Profit Jump, And Are Coalescing Around Samsung-Style Strikes

Logos for MediaTek and Samsung, with MediaTek's in orange and Samsung's in white on a blue ellipse.

Samsung’s Chairman Lee Jae-yong Has Reportedly Slipped Into Taiwan To Steal MediaTek As A Foundry Client From TSMC

AMD's EPYC Venice Becomes Industry's First 2nm HPC CPU To Achieve Volume Ramp As It Races Towards Agentic AI Leadership

AMD’s EPYC Venice Becomes Industry’s First 2nm HPC CPU To Achieve Volume Ramp As It Races Towards Agentic AI Leadership

Intel CEO Lip-Bu Tan Threatens to Fire Anyone Whose Chip Exceeds B0 Stepping, as 14A's 'Holy Grail' PDK 0.9 Lands October 2026

Intel CEO Lip-Bu Tan Threatens to Fire Anyone Whose Chip Exceeds B0 Stepping, as 14A’s ‘Holy Grail’ PDK 0.9 Lands October 2026

A person holds a computer processor in a tech-themed room with Lamborghini and Lego posters in the background.

Intel Strong-Arms PC Partners Into Buying 18A Chips, Forcing Costly Redesigns As Older Node Supply Dries Up

Logos of TSMC, Apple, and Intel are displayed on a blue gradient background.

TSMC To Shrug Off Apple’s Pivot To Intel Fabs For The M7 And A21 Chips, As Bernstein Calls The Deal’s 18A-P Node Volumes Too “Small” To Matter

TSMC is making plans towards 1nm production

TSMC Goes Full Throttle On Ultra-Advanced Nodes, Leaving Samsung In The Dust As It Begins Plans For 1nm Production

TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

TSMC Joins Applied Materials at $5B Silicon Valley Hub to Crack the 3D Transistor Wall Slowing Down Advanced AI Chips

TSMC Joins Applied Materials at $5B Silicon Valley Hub to Crack the 3D Transistor Wall Slowing Down Advanced AI Chips

NVIDIA Squashes Vera Rubin Rumors, First Shipments Rolling Out In July To Major AI Customers With Mass Production In 2H 26

AMD’s Lisa Su Quietly Cashes In On The Smartphone Industry’s Deep Freeze As MediaTek And Qualcomm Vacate TSMC’s 4nm And 5nm Lines

Elon Musk Just Visited Intel’s Oregon Fab, The Same Fab Producing Cutting-Edge Panther Lake & Next-Gen Chips on 18A

SK Hynix Buried Under Customer Cash Offers to Expand Memory Output, but Insider Warns Available Capacity Is ‘Essentially Zero’

SK Hynix Buried Under Customer Cash Offers to Expand Memory Output, but Insider Warns Available Capacity Is ‘Essentially Zero’

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