Intel’s 10nm Ice Lake Xeon Processors and Platform Details Exposed – LGA 4189 Socket, 8-Channel Memory, Up To 230W TDP SKUs

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Apr 9, 2018
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It looks like the first details regarding Intel’s future Xeon processors which will fall under the Ice Lake 10nm architecture have been revealed. The details which come from Power Stamp Alliance (via Anandtech) reveal key details about the Ice Lake-SP family and also the platform which will support it.

Intel’s Ice Lake-SP 10nm Xeon Family Detailed – New and Bigger Socket, Much Higher TDP SKUs

While Cascade Lake-SP family is yet to launch, it looks like Ice Lake-SP which is supposed to be the first 10nm Xeon family will be hitting market between 2018-2019. The key details are that Ice Lake-SP CPUs will not only be the first 10nm processors but would also feature support on an entirely new platform which have been detailed in the latest documents.

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While the current Skylake-SP Xeon family uses the LGA 3647 socket and housed on the Purely platform which will exist up till Cascade Lake-SP Xeon parts, the Ice Lake-SP family will use an entirely new socket design. This is termed as the LGA 4189 socket and will be Intel’s largest pin socket design to date. The socket will be even larger than the AMD’s TR4 / SP4 socket for Ryzen Threadripper and EPYC part which comes with 4094 LGA pins.

Coming to CPU support, the post Purely platform will house up to 230W CPUs. Note that current Skylake-SP Xeons range from 140W to 205W variants while Cascade Lake-SP parts scale from 165 to 205W variants. The higher TDP would be due to several reasons, we can see a core count and clock speed bump in addition to the expected implementation of OmniPath and on-package FPGAs features which would make a whole lot of sense for high-end Xeon Ice Lake-SP parts.

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It also looks like all three Xeon lineups which include Skylake-SP, Cascade Lake-SP and Ice Lake-SP will feature a similar power implementation and compatibility for the socket is available through an adapter but it won’t mean that CPUs from both platforms can run on the different sockets. The Ice Lake-SP parts are also rated for high-current where such an implementation can run two CPUs (Ice Lake-SP) along with 16 DDR4 memory slots.

The memory slots are noteworthy as that would make a total of 16 slots dedicated to each CPU that refers to having octa-channel memory support. This is higher than the hexa-channel memory that we are aware of on the Skylake-SP part. The Cascade Lake-SP platform features support for 2933 MHz DDR4 memory. The extra memory slots can bump the memory all the way up to 1 TB from the current maximum of 786 GB using the highest density products.

Lastly, it is stated that Power Stamp Alliance would be posting more information on the Ice Lake-SP platform around May during the Open Compute Summit so expect even more details by then.

Intel Xeon SP Families:

Family Branding Skylake-SP Cascade Lake-SP/AP Cooper Lake Ice Lake-SP/AP
Process Node 14nm+ 14nm++ 14nm++ 10nm+
Platform Name Intel Purley Intel Purley Intel Whitley Intel Whitley
MCP (Multi-Chip Package) SKUs No Expected Expected Expected
Socket LGA 3647 LGA 3647 LGA 4189 LGA 4189
Max Core Count Up To 28 Up To 28 TBA TBA
Max Thread Count Up To 56 Up To 56 TBA TBA
Max L3 Cache 38.5 MB L3 38.5 MB L3 TBA TBA
Memory Support DDR4-2666 6-Channel DDR4-2933 6-Channel TBA 8-Channel
TDP Range 140W-205W 165W-205W TBA Up To 230W
Competition AMD EPYC Naples 14nm AMD EPYC Rome 7nm AMD EPYC Rome 7nm AMD EPYC Milan 7nm+
Launch 2017 2018 2019 2020
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