AMD Mobility Radeon 7000 Series Leaked, Codenames Revealed
AMD has finally finished the release of its Top Order HD 6000 Series desktop discrete graphics processors (GPUs) and now information has leaked that its next line of GPU’s which are going to be built on the 28 nanometer fabrication process are just around the corner as the codenames of the first GPU to carry the HD7000 series brand identifiers are notebook GPUs in the MXM 3.0 form-factor. Yep! AMD Mobility will be the first to carry the HD7000 Series tags and the first one will be its low end Fusion accelerated processing units with GPUs embedded. Detail’s Below:
The Lineup starts with an Ultra High End Mobile GPU named “Wimbledon” which will feature a 256-bit wide high-speed GDDR5 memory interface, 2-4 GB of dedicated memory, and 65W TDP. This DirectX 11 M-GPU is said to be 25% faster than the “Blackcomb”, the Mobility HD 6000 series flagship and is slated for Q2-2012. The other high end chip is the “Heathrow” mGPU, which has a 192-bit or 128-bit (selectable between variants) GDDR5 memory interface, 1-3 GB of dedicated memory, up to 45W TDP, and 30% higher performance compared to “Chelsea” and will come around Q4-2011. This could also mean that the Desktop variants of the HD7000 series will be available by the end of 2011.
Coming to the Mid-End chip which includes the “Chelsea” itself, with its 128-bit GDDR5 memory interface, 1-2 GB memory, 20-30W TDP, performance 30% higher than “Whistler”, production starting in Q4-2011 and the last one codenamed “Thames” which is a mainstream chip offering 128-bit GDDR5 with option of GDDR3, 1 GB memory, 15-20W TDP, and 100% higher performance than “Seymour”, I’s also slated for Q4 2011.