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Semiconductor
JEDEC Approves SPHBM4 to Break HBM’s Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages
Expert Warns Memory Prices Will Climb Up To 50% Per Quarter, With No Relief Until 2028
Unlocking the Snapdragon 8 Elite Gen 6 Pro’s Real Performance Will Require Pairing The SoC With The Fastest RAM Available
SanDisk Bets on Stacking NAND and Compute on One Chip as HBM Shortages Choke the AI Boom
Exynos 2700’s Innovative Heat Dissipation Solutions Are Key To Compensate For Samsung’s Inferior 2nm Process, Rumor Pits TSMC’s N2P Node As Superior
TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%
Standard Snapdragon 8 Elite Gen 6 To Share One Similarity With Snapdragon 8 Elite Gen 5, But That Won’t Make It Any Less Expensive
RTX Spark Is Apple’s And Qualcomm’s Kryptonite In One Crucial Area And These Two Only Have A Year To Get Things Right
Snapdragon 8 Elite Gen 6 Pro Will Only Have Two Versions, With Block Diagrams Serving As Concrete Evidence, But Binned Parts Are Expected
Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node
Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance
ASML CEO Warns Europe is ‘Quite Behind’ in AI Race as US Buys 80% of Advanced Chips
The Future Of EUV: ASML’s Plans For The Hyperscale Era
Samsung targets late 2027 for 1d DRAM mass production, racing to power next-gen HBM5 AI memory
Qualcomm Has Six Snapdragon 8 Elite Gen 6 Pro Samples For Testing, With Evidence Showing LPDDR6 And LPDDR5X Options Available For Partners
Intel’s 18A-P Debuts Power Boost, an Industry-First Dual-Contact Transistor That Squeezes More Frequency From the Same Chip Footprint
TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant
Apple’s First 1.4nm Chipset, The A22 Pro, Could Be Powering iPhones In Just A Couple Of Years
Apple’s Software Restrictions On The M4 Were Bypassed Using Reverse Engineering, Unlocking 15.8TFLOPS Of AI Crunching Power
New Kirin SoC In The Mate 90 Said To Match TSMC’s 3nm Node, Huawei Targeting iPhone 18 Launch Timeline As Its Competitive Confidence Grows
Tensordyne’s 3nm Napier AI Chip Promises 13x Higher Token Throughput Than Blackwell & Blazes Past Rubin With 1000 Tokens/s In Multi-Trillion Parameter Models
TSMC’s Steep 2nm Price Hikes Could Push NVIDIA and Apple Toward Samsung, as GAA Pricing Opens the Door
Samsung And Elon Musk Partner Up Again, This Time For The 4th-Generation Neuralink Chip Under The 4nm Process, TSMC Seemingly Dropped
Samsung’s Foundry Profitability Aided By Improved 2nm Yields, But Business Head Says Performance-Based Bonuses Are Hindering This Division
Power Semiconductors Used In AI Data Centers Could Become Next DRAM-Level Cash Cow As South Korea Begins $329 Million R&D Plans
Japan’s Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed
AWS Graviton5 CPUs Now Available: Purpose-Built For AI With 25% Performance Uplift, 192 Cores, DDR5-8800 & PCIe Gen6 Support
TSMC’s 3nm Wafer Supply Remains Constrained For AI Customers, Even After Monthly Production Reaches New Milestone Of 175,000 Units
Intel Doubles Down on 14A as Cadence Signs Multi-Year Pact to Co-Optimize the Foundry’s “Crown Jewel” Process Tech
RTX Spark Features Altered Cortex-X925 Cores, Die Analysis Shows Attributes Taken From Dimensity 9400 & Dimensity 9500 Specifically To Tackle PC Workloads
RTX Spark To Encourage Industry Towards Lighter Laptops With Less Bulky Cooling Solutions, As Surface Laptop Ultra Targets A 110W TDP
Qualcomm’s Split 2nm Chipset Strategy Is Paying Off, But That’s Bad News For Its Rival MediaTek
Qualcomm Could Give Samsung Preferential Treatment For Its Snapdragon SoCs By Lowering Prices By 16% As It Views Exynos As A Greater Threat
Qualcomm Executive Is “Excited” For The RTX Spark’s Arrival And Wants To Welcome It To the New Family Of SoCs That’s “Growing Outside Of x86”
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