Semiconductor

Micron HBM4 memory chip displayed next to its exposed circuitry on a black background.

JEDEC Approves SPHBM4 to Break HBM’s Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages

Jun 22, 2026

Expert Warns Memory Prices Will Climb Up To 50% Per Quarter, With No Relief Until 2028

Jun 22, 2026
Snapdragon 8 Elite Gen 6 Pro must be paired with the fastest RAM available to unlock its true performance

Unlocking the Snapdragon 8 Elite Gen 6 Pro’s Real Performance Will Require Pairing The SoC With The Fastest RAM Available

Jun 22, 2026
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HBF Memory Offers Higher Capacities Than HBM But NVIDIA Isn't Interested In It (Yet), Sampling This Year With Google A Key-Customer 1

SanDisk Bets on Stacking NAND and Compute on One Chip as HBM Shortages Choke the AI Boom

Jun 21, 2026
New rumor claims Samsung's 2nm GAA process is inferior to TSMC's 2nm N2P node

Exynos 2700’s Innovative Heat Dissipation Solutions Are Key To Compensate For Samsung’s Inferior 2nm Process, Rumor Pits TSMC’s N2P Node As Superior

Jun 21, 2026
Samsung To Initiate Pilot Production Of Glass Substrates Semiconductor This Year

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%

Jun 20, 2026
Snapdragon 8 Elite Gen 6 leak shows it'll share a similarity with the Snapdragon 8 Elite Gen 5

Standard Snapdragon 8 Elite Gen 6 To Share One Similarity With Snapdragon 8 Elite Gen 5, But That Won’t Make It Any Less Expensive

Jun 20, 2026
Apple and Qualcomm are trailing behind the RTX Spark in one area

RTX Spark Is Apple’s And Qualcomm’s Kryptonite In One Crucial Area And These Two Only Have A Year To Get Things Right

Jun 20, 2026
Snapdragon 8 Elite Gen 6 Pro block diagrams

Snapdragon 8 Elite Gen 6 Pro Will Only Have Two Versions, With Block Diagrams Serving As Concrete Evidence, But Binned Parts Are Expected

Jun 19, 2026
Apple's A21 Pro could exclusively use TSMC's 2nm N2P process

Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node

Jun 19, 2026

Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance

Jun 18, 2026

ASML CEO Warns Europe is ‘Quite Behind’ in AI Race as US Buys 80% of Advanced Chips

Jun 18, 2026
A presenter on stage next to a screen displaying 'Global Leadership Meeting 2026' at an ASML event.

The Future Of EUV: ASML’s Plans For The Hyperscale Era

Jun 17, 2026

Samsung targets late 2027 for 1d DRAM mass production, racing to power next-gen HBM5 AI memory

Jun 17, 2026
Six Snapdragon 8 Elite Gen 6 Pro versions are being tested

Qualcomm Has Six Snapdragon 8 Elite Gen 6 Pro Samples For Testing, With Evidence Showing LPDDR6 And LPDDR5X Options Available For Partners

Jun 17, 2026
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Intel Intros Diamond Rapids "Xeon 7" CPUs Built On 18A-P: Packing Up To 192 Cores, 16-Channel Memory, PCIe Gen6 Support, Launching In 2027

Intel’s 18A-P Debuts Power Boost, an Industry-First Dual-Contact Transistor That Squeezes More Frequency From the Same Chip Footprint

Jun 16, 2026

TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant

Jun 16, 2026
Apple's first 1.4nm chipset, the A22 Pro, could launch in 2028

Apple’s First 1.4nm Chipset, The A22 Pro, Could Be Powering iPhones In Just A Couple Of Years

Jun 16, 2026
Apple's M4 was reverse engineered to unlock its true power

Apple’s Software Restrictions On The M4 Were Bypassed Using Reverse Engineering, Unlocking 15.8TFLOPS Of AI Crunching Power

Jun 16, 2026
Huawei's Kirin chipset found in the Mate 90 series could rival TSMC's 3nm process

New Kirin SoC In The Mate 90 Said To Match TSMC’s 3nm Node, Huawei Targeting iPhone 18 Launch Timeline As Its Competitive Confidence Grows

Jun 16, 2026
A person wearing gloves holds a TensorDyne TDN AIP chip, with visible circuitry and labeled sections.

Tensordyne’s 3nm Napier AI Chip Promises 13x Higher Token Throughput Than Blackwell & Blazes Past Rubin With 1000 Tokens/s In Multi-Trillion Parameter Models

Jun 15, 2026
Logos of 'Samsung' and 'tsmc' over a colorful semiconductor wafer background.

TSMC’s Steep 2nm Price Hikes Could Push NVIDIA and Apple Toward Samsung, as GAA Pricing Opens the Door

Jun 15, 2026
Samsung and Elon Musk to partner up for the fourth-generation Neuralink chip

Samsung And Elon Musk Partner Up Again, This Time For The 4th-Generation Neuralink Chip Under The 4nm Process, TSMC Seemingly Dropped

Jun 15, 2026
Samsung's semiconductor head says that foundry profitability is being hindered by performance-based bonuses

Samsung’s Foundry Profitability Aided By Improved 2nm Yields, But Business Head Says Performance-Based Bonuses Are Hindering This Division

Jun 15, 2026
Power semiconductors could become Korea's next DRAM-level cash cow

Power Semiconductors Used In AI Data Centers Could Become Next DRAM-Level Cash Cow As South Korea Begins $329 Million R&D Plans

Jun 14, 2026
Japan's Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed

Japan’s Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed

Jun 12, 2026
AWS Graviton5 CPUs Now Available: Purpose-Built For AI With 25% Performance Uplift, 192 Cores, DDR5-8800 & PCIe Gen6 Support

AWS Graviton5 CPUs Now Available: Purpose-Built For AI With 25% Performance Uplift, 192 Cores, DDR5-8800 & PCIe Gen6 Support

Jun 11, 2026
TSMC's 3nm supply remains choked for AI customers

TSMC’s 3nm Wafer Supply Remains Constrained For AI Customers, Even After Monthly Production Reaches New Milestone Of 175,000 Units

Jun 11, 2026
A presenter speaks on stage in front of screens displaying 'Delivering On Our Silicon Commitments' and 'intel 14A' at an Intel Foundry event.

Intel Doubles Down on 14A as Cadence Signs Multi-Year Pact to Co-Optimize the Foundry’s “Crown Jewel” Process Tech

Jun 11, 2026
RTX Spark has altered Cortex-X925 cores compared to the Dimensity 9400's

RTX Spark Features Altered Cortex-X925 Cores, Die Analysis Shows Attributes Taken From Dimensity 9400 & Dimensity 9500 Specifically To Tackle PC Workloads

Jun 7, 2026
RTX Spark will encourage laptop industry to make thinner and lighter machines

RTX Spark To Encourage Industry Towards Lighter Laptops With Less Bulky Cooling Solutions, As Surface Laptop Ultra Targets A 110W TDP

Jun 4, 2026
MediaTek could be in trouble as Qualcomm's 2nm chipset strategy is paying off

Qualcomm’s Split 2nm Chipset Strategy Is Paying Off, But That’s Bad News For Its Rival MediaTek

Jun 4, 2026
Qualcomm could offer Samsung lowered Snapdragon prices to block Exynos adoption

Qualcomm Could Give Samsung Preferential Treatment For Its Snapdragon SoCs By Lowering Prices By 16% As It Views Exynos As A Greater Threat

Jun 2, 2026
Qualcomm executive is excited for the RTX Spark's arrival

Qualcomm Executive Is “Excited” For The RTX Spark’s Arrival And Wants To Welcome It To the New Family Of SoCs That’s “Growing Outside Of x86”

Jun 1, 2026
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