Semiconductor

Apple moved forward with the M7's chip design just six months after the M6 due to AI

Apple Finalized The M7 Chip Design Just Six Months After The M6, As AI Pressures Company To Bring Neural Processing Upgrades Into Overdrive Mode

M7 Ultra to offer double the unified memory as the M5 Ultra

M7 Ultra To Offer Double The Maximum Unified Memory As The M5 Ultra, Potentially Opening Doors To Run 1 Trillion-Parameter Models Locally

Apple is already developing the M8

Apple’s Chipset Development Is Unparalleled As Company Is Already Working On The M8, Flaunting Superior AI Capabilities Not To Mention Enhanced Efficiency

TSMC Arizona is sending engineers to Taiwan for 3nm and 2nm production training

TSMC Can’t Keep Up With CoWoS Demand, Sending Advanced Packaging Orders Spilling Over To Intel & Rival Taiwanese Fabs

Huawei is building its own DRAM manufacturing plant

Huawei Aims To Reduce The DRAM Supply Shortage With An Approach Only The Brave And The Bold Can Execute; Building Its Own Fabrication Plant

The deep integration of Apple's A20 Pro and Korean DRAM might make it difficult for the iPhone 18 Pro models to feature Chinese memory

iPhone 18 Pro Unlikely To Use CXMT DRAM Due To Deep Integration Between A20 Pro’s Newer Packaging And Samsung, SK hynix Memory; Rumor Shares One Silver Lining

Intel EMIB-T Breaks Past Existing AI & HPC Scaling Limits, Enabling Ultra-Large Die Complexes With Over 10x Reticle Dies & 12 Gb/s+ HBM4e DRAM

Samsung to take three generations before unveiling its first 1.4nm Exynos chipset

Samsung Will Take Three Generations To Unveil Its First 1.4nm Exynos SoC, But The Delay Could Prove Beneficial Despite TSMC Obtaining A Lead

Samsung is re-entering the PC market with its AI accelerator

AI Catapulted Samsung’s Memory Business To New Heights; Now, It’s Pushing The Development Of A 4nm AI Accelerator SoC For PCs To Take On Qualcomm

A close-up of a server rack filled with rows of NVIDIA processing units, illuminated under stage lighting.

NVIDIA’s Rubin Ultra Rack Estimated To Cost $21 Million, With HBM4e Memory Alone Swelling To $1.5 Million Per Unit

Tensor G7 is being tested with LPDDR5X and LPDDR6 memory packaging

Tensor G7 Could Arrive With A Key Upgrade That’ll Make Nearly Everything Better About The Pixel 12, Assuming You’re Incredibly Patient

Samsung has three Exynos chipset releases planned

Samsung Going Full Throttle With Exynos SoC Development, As Company Has Three Generations Of Releases Planned To Rid Itself Of Qualcomm

Snapdragon planning to use an even better version of the Snapdragon 8 Elite Gen 5 for its Galaxy Z Fold 8 series

Qualcomm’s Preferential Treatment Of Samsung Means The Galaxy Z Fold 8 Lineup Will Feature An Upgraded Snapdragon 8 Elite Gen 5 With Better AI Performance

A20 Pro will not support LPDDR6 RAM

A20 Pro Won’t Break Apple’s Long-Held Tradition; No LPDDR6 RAM Support, But Faster Six-Channel Memory With Increased Bandwidth For AI Workloads

DeepSeek Looks To Sidestep Huawei As It Begins In-House AI Chip Journey While Dodging Development Complications, Trade Sanctions, Delays & More

Intel's XBM Memory Takes Aim At HBM4, Promising 32 GT/s Speeds And Lower Costs Through UCIe Links

Intel’s XBM Memory Takes Aim At HBM4, Promising 32 GT/s Speeds And Lower Costs Through UCIe Links

Check out these high-resolution iPhone 18 Pro logic board pictures showing the A20 Pro

iPhone 18 Pro Logic Board’s High-Resolution Images Show A20 Pro Occupying Larger Die Area With Next-Generation Packaging & Qualcomm 5G Modem

Broadcom enters new chip supply agreement with Apple

Broadcom Avoids Qualcomm’s Fate; Enters Into New Agreement With Apple, One That Ensures A Steady Chip Supply And Revenue For Several Years

Intel Plots A 14A Gen2 Node With Dual-Side Power Delivery To Counter TSMC And Samsung’s 1.4nm Push

CXMT is working on a high-density DRAM that could force Apple to do whatever it takes to form a partnership

CXMT Could Give Apple One More Reason To Pursue A DRAM Partnership, As Chinese Firm Is Working On A Game-Changing High-Density Memory Without Using EUV

Rumor claims AI was responsible for Apple dropping its older chipset packaging

AI Forced Apple To Abandon Its Older, Slower Packaging, With The Upgrades Arriving To A20 Pro Making It Suitable To Handle Larger Data Volumes

Huawei's hybrid bonding technology showcased for the Kirin 2026

Huawei Reveals Hybrid Bonding Process For The Kirin 2026’s 3D Stacking Design In New Paper To Intensify Competition; Perks Include Better Efficiency & Bandwidth

AI could wipe out budget smartphones in 2027, warn experts

AI Could Wipe Out Budget Smartphones In 2027, As Experts Warn DRAM Chip Supply For AI Hardware To Account For More Than 60% Of Annual Supply

Apple A20 and A20 Pro - here is everything to know about the iPhone's first 2nm chipsets arriving in 2026

Apple A20 And A20 Pro, The iPhone’s First 2nm Chipsets With Next-Generation Packaging – Here’s Everything You Need To Know

Base iPhone 18's A20 rumored to be fabricated on Intel's 18A process

Apple’s Dual-Foundry Approach To Reach Fruition Much Faster Than Anticipated, As Company Plans To Adopt Intel’s 18A Process For The Base iPhone 18’s A20

Samsung developing a more advanced version of its 1.4nm process

Samsung Doubling Down On Newer 1.4nm+ Nodes Through Design And Optimization Techniques, As It Enters The Advanced Sub-2nm Club With TSMC & Intel

A close-up of a Samsung semiconductor wafer with the text '1.4nm' displayed prominently beside it.

Samsung Ready To Tackle Intel & TSMC With Its 1.4nm Process Tech, Aiming Mass Production For 2029

Samsung could aid Apple's 1.4nm transition as it begins its own commercialization plans

Samsung Could Aid Apple’s Rapid 1.4nm Transition, As Foundry Giant Reportedly Restarting Commercialization Of Next-Generation Lithography

CXMT Can Witness Explosive Growth By Becoming Apple’s DRAM Supplier For Several Years As Just A Single Deal Represents A Promising Future For The Chinese Firm

M7 Ultra Mac Studio to finally get a redesign

Mac Studio Redesign Isn’t Expected Until The M7 Ultra Arrives In 2028, And That’ll Only Happen Because Of Increased Power Requirements

Apple to drop 2nm node in just two generations, with the 1.4nm process being secured for the A22 Pro

Apple Being Forced To Drop 2nm Process After Just Two Generations Because Of AI, As Race To Secure 1.4nm Supply Takes Paramount Importance

Samsung shows the future of smartphone SoC packaging with its Exynos 2600

Samsung Is Paving The Way For Next-Generation Smartphone SoC Packaging, Squeezing Half The LPDDR5X Chip Size On Its Exynos 2600 With No Performance Loss

A20 Pro packaging and logic board leaked

Apple’s A20 Pro With Newer Packaging On iPhone 18 Pro Logic Board Allegedly Leaked, Showing Bigger NPU But No Change To Package Size Compared To A19 Pro

Apple's M7 to bring new on-device AI performance to the table

Apple’s M7 To Bring New On-Device AI Performance Levels, With Its Unified Memory Bandwidth Reportedly 56% Higher Than M5, Launch Expected In H1 2027

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