Semiconductor Page 2 of 17

RTX Spark now shown running Alan Wake 2

RTX Spark Once Again Hinted To Have A Surprisingly Powerful GPU, With A Laptop Featuring The SoC Running Alan Wake 2 With Ray Reconstruction Enabled

Jun 1, 2026
RTX Spark offers decent performance results in Clang, beating the M5 Pro comprehensively

RTX Spark Gives Decent First Impression Of Its Performance In Developer Workloads Benchmark, Beats M5 By 54%, Marginally Slower Than Base M5 Pro

Jun 1, 2026
NVIDIA to expand RTX Spark lineup with the introduction of Vera Rubin Spark & Rosa Feynman Spark architectures, arriving in 2027

RTX Spark To Jumpstart New Lineup As NVIDIA Will Expand With Vera Rubin Spark & Rosa Feynman Spark Architectures With LPDDR6 RAM Support, Arriving 2027 Onwards

Jun 1, 2026
A close-up of an NVIDIA GPU alongside a TSMC wafer, with the text 'The World's Most Advanced GPU' displayed above.

TSMC Now Pays Its Biggest Customer NVIDIA, Pulling CUDA-X Into the Fab to Slash Lithography Costs by Up to 50%

Jun 1, 2026
Snapdragon C could be hiding a nasty surprise

Qualcomm’s Snapdragon C Is Hiding A Nasty Secret That, If Proven, Will Make The MacBook Neo And Its A18 Pro Roar In Popularity

May 31, 2026
Qualcomm may once again command a higher SoC share in Samsung's upcoming Galaxy S27 series

Qualcomm May Once Again Command A Higher Share Of Snapdragon SoCs Found In The Galaxy S27 Series, And It’s Thanks To One Clever Strategy

May 31, 2026
Snapdragon C is proof enough that Qualcomm is serious about the MacBook Neo, but it's partners aren't

Snapdragon C Is Proof That Qualcomm Is Serious To Take On The MacBook Neo, But Its Partners Aren’t; By The Time They Are, It’ll Be Too Late

May 29, 2026
Exynos 2600's Heat Pass Block can perform better than a Snapdragon 8 Elite Gen 5 with liquid-nitrogen cooling

Exynos 2600’s Heat Pass Block Performs Better Than A Liquid-Nitrogen-Cooled Snapdragon 8 Elite Gen 5, Enabling Practical Uses For Future SoCs

May 29, 2026
An M1 Max was transplanted on a working logic board to breath life into a new Mac

An M1 Max Was “Transplated” To A Donor Board Using Skilled Hands, Knowledge And Patience, Giving A MacBook Pro A New Lease On Life

May 28, 2026
A close-up of a glowing semiconductor chip with intricate circuitry patterns suspended above a blue-lit circuit board.

Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore’s Law Itself — And A Top Chip Analyst Isn’t Buying It

May 27, 2026
NVIDIA's Vera CPU Locks In CoreWeave, Meta, Oracle and Alibaba as Early Buyers, Opening a Multi-Billion-Dollar Front Beyond Rubin Racks

NVIDIA’s Vera CPU With 88 Olympus “Arm” Cores Outperforms AMD EPYC & Intel Xeon In First Benchmarks

May 26, 2026
Huawei is preparing the Kirin 9050 and it's reported to beat the A18 Pro

Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations

May 25, 2026
Intel Foundry's Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

Intel Foundry’s Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

May 25, 2026
Samsung Leapfrogs Toward 1000-Layer NAND With First 900-Layer V-NAND Prototype, Stacking Two 450-Layer Cells Into One

Samsung Leapfrogs Toward 1000-Layer NAND With First 900-Layer V-NAND Prototype, Stacking Two 450-Layer Cells Into One

May 25, 2026
Huawei has unveiled its plan to take on TSMC and Samsung

Huawei Planning To Launch Chip Lithography Equal To TSMC’s 1.4nm Process By 2031, Showing That U.S. Sanctions Won’t Stifle Its Progress

May 25, 2026
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Huawei is working on a new packaging technology for Kirin chipsets that will upgrade nearly all of their attributes

Huawei Adopts “LogicFolding Design” Technology For Its Future Kirin Chipsets, Enabling All Sorts Of Perks Like Boosting Density By 53%, Clock Speeds By 12.7% & More

May 25, 2026
Exynos 2700 can create a lot of trouble for Qualcomm and TSMC next year, if Samsung wants

Exynos 2700 Can Brew Trouble For Both TSMC And Qualcomm Next Year, But Samsung Has To Go The Extra Mile For That To Happen

May 23, 2026
Xiaomi to continue its investment in XRING chipsets for the next 5 years

Xiaomi Getting Serious About Custom Silicon, Projects XRING Series To Be A Part Of $28 Billion Investment For The Next 5 Years

May 21, 2026
Apple's A20 and A20 Pro to offer one advantage that will help deliver incredible battery life

Apple’s A20 And A20 Pro Will Have One Huge Advantage Besides The 2nm Process To Help Achieve A New Record In Battery Life & Performance

May 21, 2026
Intel's Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 Rollout

Intel’s Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 Rollout

May 20, 2026
Alibaba Targets NVIDIA's Hopper With Zhenwu M890 AI Chip, Claiming 3x The H20 Performance, 144GB HBM3 & A Roadmap Through 2028

Alibaba Targets NVIDIA’s Hopper With Zhenwu M890 AI Chip, Claiming 3x The H20 Performance, 144GB HBM3 & A Roadmap Through 2028

May 20, 2026
Android chipset makers are losing millions by failing to adopt this Apple practice

Android Chipset Makers Are Losing Millions Of Dollars By Failing To Adopt An Apple Strategy Practiced Since The Original iPad Launch

May 18, 2026
TSMC is making plans towards 1nm production

TSMC Goes Full Throttle On Ultra-Advanced Nodes, Leaving Samsung In The Dust As It Begins Plans For 1nm Production

May 18, 2026
Xiaomi executive confirms the XRING 03 will launch in 2026

Xiaomi Executive Confirms The In-House XRING 03 Will Arrive This Year, But A Technological Disadvantage Could Make Its Launch Meaningless

May 16, 2026
Samsung may not drop advanced packaging from its Exynos 2700

Exynos 2700 To Receive Premium Treatment From Samsung As Update Drops Claims Of Company Abandoning Its 2nm SoC’s Advanced Packaging

May 15, 2026
Samsung may observe cost-cutting for the Exynos 2700

Samsung’s RAM Shortage Struggles Claims Another Victim As Exynos 2700 To Witness One Trade-Off, Despite Being The Most Advanced 2nm SoC

May 14, 2026
Qualcomm and MediaTek have a stronger 2nm base to beat Apple this year

Qualcomm & MediaTek Have A Stronger 2nm Base To Beat Apple This Year, But Architectural Improvements Will Also Decide The Outcome

May 14, 2026
Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

May 13, 2026
Snapdragon 8 Elite Gen 6 Pro could be Qualcomm's most expensive chipset to date

Snapdragon 8 Elite Gen 6 Pro To Be Out Of Reach For Many Of Qualcomm’s Partners, As 2nm Process Will Shoot Prices To Abnormal Levels

May 12, 2026
Qualcomm's and MediaTek's 2nm chipsets could be extremely costly this year

Qualcomm & MediaTek Are Obsessed With Closing The Performance Gap Against Apple, So Much So That Their 2nm SoCs Could Risk Mass Adoption

May 11, 2026
Loongson Targets Intel 12th Gen and Radeon RX 550 Performance With 3B6600 CPUs and 9A1000 GPUs Launching Next Year

Loongson Targets Intel 12th Gen and Radeon RX 550 Performance With 3B6600 CPUs and 9A1000 GPUs Launching Next Year

May 11, 2026

NVIDIA Squashes Vera Rubin Rumors, First Shipments Rolling Out In July To Major AI Customers With Mass Production In 2H 26

May 10, 2026
SMIC founder says it's a misconception to says that success can only be achieved when manufacturing 3nm or 2nm wafers

SMIC Founder Says It’s A “Misconception” That Semiconductor Success Is “Only Achieved When 3nm Or 2nm Is Reached” In New Interview

May 10, 2026
An individual in a leather jacket is presenting a large circuit board design next to a stack of horizontal units.

NVIDIA Rubin & Rubin Ultra Platforms Facing Design/Spec Issues As Per Rumors While AMD MI500 Positioned For 2H 2027 Launch

May 9, 2026
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