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Apple's M7 to bring new on-device AI performance to the table

Apple’s M7 To Bring New On-Device AI Performance Levels, With Its Unified Memory Bandwidth Reportedly 56% Higher Than M5, Launch Expected In H1 2027

A tipster highlights the primary specifications between the Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6

Snapdragon 8 Elite Gen 6 Pro Specification Differences Between Snapdragon 8 Elite Gen 6 Show Why It’ll Be Exclusive For Premium Flagships

Apple isn't planning an M6 Pro or M6 Max launch, as new report claims these will arrive with the M7

Apple Silicon Shake-Up Expected This Year With The M6 Launch, With ‘Pro’ And ‘Max’ Versions Getting Skipped Until The M7’s Release

A close-up view shows a person holding a colorful, intricate semiconductor wafer with gloved hands, alongside a magnified portion displayed on a stand.

IBM’s 0.7 Nanometer “Nanostack” Chipmaking Technology Shows America’s Semiconductor Innovation Still Leads The World

Qualcomm Claims Single-Core Leadership for Its First Server CPU, the Dragonfly C1000, Delivering 250+ Cores & 5 GHz By 2028

Qualcomm Claims Single-Core Leadership for Its First Server CPU, the Dragonfly C1000, Delivering 250+ Cores & 5 GHz By 2028

A layered chip with gold-colored elements is shown above the text '200x capacity per watt vs. SRAM*'.

Qualcomm’s HBC Stacks Compute Beneath DRAM To Smash The AI Memory Wall, Claiming 6x The Bandwidth Per Watt Of HBM

Two people holding a plaque with a wafer labeled 'Jalapeño Intelligence Processor'.

OpenAI’s First Custom Chip Is As Hot As A Jalapeño For AI, As The Firm Calls It The “Best Inference Platform” for LLMs

Google Taps MediaTek to Build TPUv9 "Triggerfish," Fusing CPU and Compute Die in One Package for Agentic AI

Google Taps MediaTek to Build TPUv9 “Triggerfish,” Fusing CPU and Compute Die in One Package for Agentic AI

Samsung Aims For 900+ Layer NAND SSD Storage Solutions By 2030, Uses Dual 450-Layer Cells Bonded Together

Samsung bonds two 450-layer NAND cells into one chip as it chases 1000-layer SSDs that quadruple capacity by 2030

Micron HBM4 memory chip displayed next to its exposed circuitry on a black background.

JEDEC Approves SPHBM4 to Break HBM’s Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages

Expert Warns Memory Prices Will Climb Up To 50% Per Quarter, With No Relief Until 2028

Snapdragon 8 Elite Gen 6 Pro must be paired with the fastest RAM available to unlock its true performance

Unlocking the Snapdragon 8 Elite Gen 6 Pro’s Real Performance Will Require Pairing The SoC With The Fastest RAM Available

HBF Memory Offers Higher Capacities Than HBM But NVIDIA Isn't Interested In It (Yet), Sampling This Year With Google A Key-Customer 1

SanDisk Bets on Stacking NAND and Compute on One Chip as HBM Shortages Choke the AI Boom

New rumor claims Samsung's 2nm GAA process is inferior to TSMC's 2nm N2P node

Exynos 2700’s Innovative Heat Dissipation Solutions Are Key To Compensate For Samsung’s Inferior 2nm Process, Rumor Pits TSMC’s N2P Node As Superior

Samsung To Initiate Pilot Production Of Glass Substrates Semiconductor This Year

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%

Snapdragon 8 Elite Gen 6 leak shows it'll share a similarity with the Snapdragon 8 Elite Gen 5

Standard Snapdragon 8 Elite Gen 6 To Share One Similarity With Snapdragon 8 Elite Gen 5, But That Won’t Make It Any Less Expensive

Apple and Qualcomm are trailing behind the RTX Spark in one area

RTX Spark Is Apple’s And Qualcomm’s Kryptonite In One Crucial Area And These Two Only Have A Year To Get Things Right

Snapdragon 8 Elite Gen 6 Pro block diagrams

Snapdragon 8 Elite Gen 6 Pro Will Only Have Two Versions, With Block Diagrams Serving As Concrete Evidence, But Binned Parts Are Expected

Apple's A21 Pro could exclusively use TSMC's 2nm N2P process

Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node

Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance

ASML CEO Warns Europe is ‘Quite Behind’ in AI Race as US Buys 80% of Advanced Chips

A presenter on stage next to a screen displaying 'Global Leadership Meeting 2026' at an ASML event.

The Future Of EUV: ASML’s Plans For The Hyperscale Era

Samsung targets late 2027 for 1d DRAM mass production, racing to power next-gen HBM5 AI memory

Six Snapdragon 8 Elite Gen 6 Pro versions are being tested

Qualcomm Has Six Snapdragon 8 Elite Gen 6 Pro Samples For Testing, With Evidence Showing LPDDR6 And LPDDR5X Options Available For Partners

Intel Intros Diamond Rapids "Xeon 7" CPUs Built On 18A-P: Packing Up To 192 Cores, 16-Channel Memory, PCIe Gen6 Support, Launching In 2027

Intel’s 18A-P Debuts Power Boost, an Industry-First Dual-Contact Transistor That Squeezes More Frequency From the Same Chip Footprint

TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant

Apple's first 1.4nm chipset, the A22 Pro, could launch in 2028

Apple’s First 1.4nm Chipset, The A22 Pro, Could Be Powering iPhones In Just A Couple Of Years

Apple's M4 was reverse engineered to unlock its true power

Apple’s Software Restrictions On The M4 Were Bypassed Using Reverse Engineering, Unlocking 15.8TFLOPS Of AI Crunching Power

Huawei's Kirin chipset found in the Mate 90 series could rival TSMC's 3nm process

New Kirin SoC In The Mate 90 Said To Match TSMC’s 3nm Node, Huawei Targeting iPhone 18 Launch Timeline As Its Competitive Confidence Grows

A person wearing gloves holds a TensorDyne TDN AIP chip, with visible circuitry and labeled sections.

Tensordyne’s 3nm Napier AI Chip Promises 13x Higher Token Throughput Than Blackwell & Blazes Past Rubin With 1000 Tokens/s In Multi-Trillion Parameter Models

Logos of 'Samsung' and 'tsmc' over a colorful semiconductor wafer background.

TSMC’s Steep 2nm Price Hikes Could Push NVIDIA and Apple Toward Samsung, as GAA Pricing Opens the Door

Samsung and Elon Musk to partner up for the fourth-generation Neuralink chip

Samsung And Elon Musk Partner Up Again, This Time For The 4th-Generation Neuralink Chip Under The 4nm Process, TSMC Seemingly Dropped

Samsung's semiconductor head says that foundry profitability is being hindered by performance-based bonuses

Samsung’s Foundry Profitability Aided By Improved 2nm Yields, But Business Head Says Performance-Based Bonuses Are Hindering This Division

Power semiconductors could become Korea's next DRAM-level cash cow

Power Semiconductors Used In AI Data Centers Could Become Next DRAM-Level Cash Cow As South Korea Begins $329 Million R&D Plans