Intel's process technology roadmap is expected to see an optimized version of the 14A node with dual-sided architecture.
Intel 14A Gen2 Is Being Considered To Tackle TSMC and Samsung 1.4nm Technologies, Offering Improved Process Maturization & Dual-Side Architecture
TSMC and Samsung are heating up the foundry space with 1.4nm offerings in the coming years. TSMC is bringing its A14 fabs online next year, & Samsung is targeting 2029 for mass production of its 1.4nm tech. Meanwhile, Intel is set to launch its groundbreaking 14A technology in the coming year, as external customers line up to get a taste of Chipzilla's rejuvenated foundry and manufacturing business.
As all of this is happening, Intel is considering updates to its process technology roadmap. These updates are mainly to tackle the upcoming showdown with TSMC and Samsung. Among the node updates is a brand new addition, which is being referred to as 14A2, as per ETNews. The new tech is going to be a refinement of the standard 14A technology.
Intel 14A utilizes PowerDirect, adding Back Power Delivery Networks (BSPDN). The 14A2 node is going to feature a dual-sided architecture, utilizing power delivery from both the front & back sides. The M0 pitch for the base 14A node will be reduced to 28nm, but 14A2 will reduce the pitch size further down to 21nm.
According to industry sources, Intel had planned to apply 'PowerDirect,' a technology dedicated to Back Power Delivery Networks (BSPDN), to its base 1.4nm process, 14A; however, it is reportedly considering the introduction of a 'Dual Side' architecture that utilizes both front and back power for the subsequent 14A2 process.
via ETNews
This will be enabled through improvements such as double patterning, which also offers density gains. 14A is already poised to offer a 30% uplift in transistor density, so we can expect further density with 14A2.
While this will help utilization of the High-NA EUV equipment, improving the per-machine profitability, the 21nm pitch size also comes with some complications, such as an increase in resistance. The nTSVs (Nano Through Silicon Vias) are also not designed to handle these increased densities. For this, Intel is said to have adopted a composite structure which uses BSPDN as the main power source but also allocates a portion to the front-side metal.
Semiconductor firms are firing on all cylinders as compute and AI demands spiral out of control. As TSMC gets piled up with tons of orders, chip makers are looking at other Foundries, such as Intel and Samsung. Intel is riding a heightened wave of confidence, but they still have a lot to prove in the semiconductor manufacturing business, especially for its external customers, and products such as 18A-P, 14A, and now 14A2 have all eyes set on them.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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