Micron Is The First Manufacturer To Ship 128 GB DDR5 RDIMM For Servers, Up To 8000 MT/s

Muhammad Zuhair
Micron Is The First Manufacturer To Ship 128 GB DDR5 RDIMM For Servers, Up To 8000 MT/s 1
Image Credits: Micron

Micron has become the first manufacturer to ship out high-end DDR5 RDIMM memory for AI data centers, running at up to 8000 MT/s.

Micron Sets A New Record In The Server Industry, Ships Out 32Gb DRAM Die-Based 128 GB DDR5 RDIMM Memory Which Runs At A Blistering Fast 8000 MT/s

[Press Release]: Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron’s industry-leading 1β (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency, and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

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Fast Performance for AI in the Data Center

  • Micron high-capacity DDR5 delivers up to 28% faster performance for AI training.

Up to 16% improved latency

  • Important for memory-bound workloads such as generative AI, in-memory databases, and real-time data analytics, where high capacity is needed, and prompt response times are critical for real-time inference.

Highest Bandwidth DDR5 with capability up to 8000 MT/s

Low power and energy efficiency for data center workloads

  • >24% improved energy efficiency (pj/bit)

Innovative 1β technology

  • 45% improvement in wafer bit density using Micron’s leading 1-beta technology based on 32Gb die, enabling the best bit density in the industry.
  • Micron’s 1β 128GB RDIMM helps to balance CPU core counts with memory capacity, bandwidth, and power for optimized system performance, enabling future data center infrastructure.
Image Source: Micron

Micron’s collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. Micron’s 128GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along many others.

With this latest volume shipment milestone, Micron continues to lead the market in providing high-capacity RDIMMs that have been qualified on all the major CPU platforms to our customers.

AI servers will now be configured with Micron’s 24GB 8-high HBM3E for GPU-attached memory and Micron’s 128GB RDIMMs for CPU-attached memory to deliver the capacity, bandwidth and power-optimized infrastructure required for memory intensive workloads.

- Praveen Vaidyanathan, VP and GM of Micron’s Compute Products Group

Micron 128GB DDR5 RDIMM memory is available now directly from Micron and will be available through select global channel distributors and resellers in June 2024. As part of its comprehensive data center memory portfolio, Micron offers a wide array of memory options across DDR5 RDIMMs, MCRDIMMs, MRDIMMs, CXL, and LPDDR5x form factors to allow customers to integrate optimized solutions for AI and high-performance computing (HPC) applications that suit their needs for bandwidth, capacity and power optimization. For more information, visit Micron’s DDR5 webpage.

Muhammad Zuhair Photo

About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.

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