Maxsun has submitted several next-gen Intel and possibly, AMD 800-series motherboards ahead of launch, including the flagship Z890 series.
Maxsun's Next-Gen Motherboards Include Several 800-Series Chipsets Such As Intel Z890, B860, H810, While B850 & B840 Are Most Likely AMD AM5 Offerings
Intel and AMD's motherboard partners will unveil the next-gen 800-series motherboards at Computex 2024. While the event itself is a few days to go, it looks like a submission by Maxsun over at EEC (Eurasian Economic Commission) has exposed what consumers should expect.
Starting with the submissions, we have the Maxsun Intel 800-series which includes the Z890, B860, and H810 motherboards in several offerings that should cover the premium high-end, mid-tier & budget market segment. These motherboards will feature the new LGA 1851 socket which will be compatible with Intel's next-gen Arrow Lake-S "Core Ultra 200" Desktop CPUs.
In addition to the Intel offerings, it looks like Maxsun has also hinted at AMD's upcoming 800-series as the vendor has also submitted B850 and B840 motherboards. Intel isn't known to use these naming conventions for its chipset and these might as well be placeholders but it was recently reported that AMD has also switched the branding of its next-gen motherboard PCH from 700-series to 800-series.
As such, the B850 motherboards should be the follow-up to the B650 series while the B840 might just be a more cost-effective option. It may be possible that instead of using the "E" (Extreme) tag, AMD might just lower the non-Extreme boards in terms of numbers so we can speculate something like X870 and X860 at the high-end and B850 and B840 for the mid-tier segment.
Following is the full list of 800-series motherboards that the company has submitted so far"
- MS-iCraft Z890 VERTEX
- MS-iCraft Z890 ARCTIC
- MS-iCraft Z890 PACIFIC
- MS-Terminator Z890-A
- MS-iCraft Z890ITX
- MS-ESPORT Z890M WIFI
- MS-Challenger Z890M WIFI
- MS-iCraft B860M CROSS
- MS-Terminator B860M
- MS-Terminator B860M GKD
- MS-ESPORT B860M SNIPER WIFI
- MS-ESPORT B860M GANK WIFI
- MS-ESPORT B860M ACE WIFI
- MS-Challenger B860M-E
- MS-Challenger B860M-F
- MS-Challenger B860M
- MS-MILESTONE B860M
- MS-Challenger B860ITX
- MS-Challenger B860BKB
- MS-Terminator B860YTX
- MS-Terminator B860ITX
- MS-ESPORT H810M GANK WIFI
- MS-Challenger H810M
- MS-Challenger H810M-K
- MS-Challenger H810M-F
- MS-Challenger H810M-D
- S-Terminator B850M WIFI
- MS-Esports B850M WIFI6 ICE
- MS-Terminator B850ITX WIFI
- MS-Challenger B850M WIFI ICE
- MS-Challenger B840M 2.5G
Unlike the Intel 800-series motherboards which will only support Arrow Lake CPUs, the AMD 800-series motherboards will be compatible with Ryzen 7000, Ryzen 8000, Ryzen 9000, and future Zen offerings too on the same AM5 platform.
AMD & Intel Next-Gen Desktop CPU Platforms:
| CPU Family | AMD Granite Rapids | Intel Arrow Lake |
|---|---|---|
| CPU Branding | Ryzen 9000 | Core Ultra 200 |
| Architecture | TSMC N4 | TSMC N3B? |
| IPC | +16% (Versus Zen 4) | ~14% (Versus Redwood Cove)? |
| Max Cores | 16 | 24 |
| Max Threads | 32 | 24 |
| Architecture | Zen 5 | Lion Cove + Skymont |
| L3 Cache | Up To 64 MB | Up To 36 MB |
| iGPU | RDNA 2 (2 CU) | Arc Xe-LPG (GT1) |
| Memory Support | DDR5-5600+ | DDR5-6400+ |
| Platform Support | 600/800-Series | 800-Series |
| Socket Support | AM5 | LGA 1851 |
| TDP | Up To 170W | Up To 253W (PL2)? |
| Launch | July 2024 | October 2024 |
News Source: @harukaze5719
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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