iPhone 7 Will Be Waterproof, But Not As Much As You Think
iPhone 6s featured a tiny rubber tubing inside the surroundings of its metal body, making it waterproof to a certain extent. Now, just like its predecessor, iPhone 7 might also feature the same perk, but that does not necessarily mean that it will possess some form of certification.
iPhone 7 Will Not Be IP68 Certified – Will Be Far More Waterproof Than An iPhone 6s
To remind you the waterproofing feature of iPhone 6s, we have placed a video for you below. As for iPhone 7, according to a source close to the matter, the upcoming handset might not provide support for the IP68 certification, but it does not mean that it isn’t going to be waterproof. To refresh your memory, an IP68 certification is given to those handsets which are able to remain functional after being submerged to a depth of 5 feet and for a duration of 30 minutes.
One of the attributes that we believe will contribute to this waterproofing future is the rumored absence of a physical home button on an iPhone 7. It is possible that the 3D Touch button provides a vibrational effect that will give the user the impression that they are pressing a physical button. We aren’t sure if the upcoming smartphone is even going to be called iPhone 7 or not, since there is another rumor suggesting that iPhone 6SE could be used to name the family. What we do know is that the iPhone 7 lineup will be available in the following colors:
- Rose Gold
- Space Black
From a hardware perspective, the upcoming iPhone 7 models are going to feature an A10 SoC, and from the looks of it, the chipset is powerful, but not as much as we would want it to be. The phone could also feature LTE modems from two different companies, and we believe that the phablet sized brothers are going to feature a 3,100mAh battery, which is huge even by Apple standards, along with on-board storage increased to 256GB. We expect that 256GB will be nice little upgrade for those who have capped their 128GB internal memory (for a premium price obviously).
Apple is also said to adopt a new chip developing technology called FoWLP, which stands for fan-out wafer level packaging platform. With this technology, smartphone OEMs can greatly reduce the thickness of their mobile devices since FoWLP does not require a PCB. Additionally, it is able to increase the efficiency of chips by 30 percent and reduce the thickness of smartphones by at least 0.3mm. We bet Apple’s ears must be ringing when they were pitched that smartphone thickness could be using by employing this technology in mobile devices.
As a potential iPhone 7 customer are you satisfied that you will see some level of waterproofing on the upcoming lineup? Tell us your thoughts right away.
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