AMD Strix Halo Render Reveals Powerful Ryzen APU Design: 16 Zen 5 Cores, 40 RDNA 3+ GPU Cores, 64 MB L3 Cache

Hassan Mujtaba
AMD Strix Halo Render Reveals Powerful Ryzen APU Design: 16 Zen 5 Cores, 40 RDNA 3+ GPU Cores, 64 MB L3 Cache 1

AMD's Strix Halo, the higher-end Ryzen APU, which will power enthusiast laptops with up to 16 Zen 5 cores & 40 RDNA 3+ GPU cores has been revealed in a render diagram published by @Olrak_29.

AMD Strix Halo Render Reveals High-End Chiplet-Based Ryzen APU With Up To 16 Zen 5 CPU Cores & 40 RDNA 3+ GPU Cores

The AMD Strix Halo APUs will be the chiplet offerings, utilizing up to 3 dies, 2 CCDs, and 1 GCD. The chips will feature up to 16 Zen 5 cores with 32 threads. These chips will retain the same L1 and L2 cache structure so that's a maximum of 16 MB L2 cache while the L3 cache will be increased to 32 MB per CCD. So we can see up to 64 MB of L3 cache on the top (two CCD) chips. The CCDs are said to be different than the ones used on Granite Ridge. Also, only the GCD is mentioned which means that there might be no IOD on board the package.

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In fact, based on the render diagram, the AMD Strix Halo APU will incorporate all of the I/O blocks within the GCD which is the largest of the three dies. It will contain an XDNA 2 AI NPU with over 40 TOPs, 32 MB of Infinity Cache, 256-bit LPDDR5X memory and it looks like there will also be Zen 5 LP (Low-Power) cores onboard this die. The GCD/IOD will be connected to the dual Zen 5 CCDs using an Infinity Fabric interconnect.

Image Source: @Olrak_29

For the iGPU side, the Strix Halo APUs will retain the RDNA 3+ graphics architecture but will come equipped with 20 WGPs or 40 Compute units. Additionally, to support such high-end iGPUs on a chiplet design, there will also be an additional 32 MB of MALL cache onboard the IOD that will be eliminating bandwidth bottlenecks for this uber iGPU.

Other specifications include support for up to LPDDR5x-8000 (256-bit) memory, and an AI "XDNA 2" NPU capable of delivering over 70 TOPs. The Strix Halo APUs will be centered around the latest FP11 platforms. These APUs will feature TDPs of 70W (cTDP 55W) and will support peak ratings of up to 130W.

AMD Ryzen AI HX Strix Halo Expected Features:

  • Zen 5 Chiplet Design
  • Up To 16 Cores
  • 64 MB of Shared L3 cache
  • 40 RDNA 3+ Compute Units
  • 32 MB MALL Cache (for iGPU)
  • 256-bit LPDDR5X-8000 Memory Controller
  • XDNA 2 Engine Integrated
  • Up To 70 AI TOPS
  • 16 PCIe Gen4 Lanes
  • 2H 2024 Launch (Expected)
  • FP11 Platform (55W-130W)

For display, both AMD Strix and Strix Halo APUs will come with eDP (DP2.1 HBR3) and external DP (DP2.1 UHBR10), USBC Alt-DP (DP2.1 UHBR10) and USB4 Alt-DP (DP2.1 UHBR10) support as a part of their media engines. Strix Halo will feature up to DP2.1 UHBR20 support.

AMD is expected to formally announce and unveil its next-gen Zen 5 "Ryzen" CPU portfolio at its Computex 2024 keynote so expect more information in less than a month.

AMD Ryzen Mobility CPUs:

CPU Family NameAMD Sound Wave?AMD Bald Eagle PointAMD Krackan PointAMD Fire RangeAMD Strix Point HaloAMD Strix PointAMD Hawk PointAMD Dragon RangeAMD PhoenixAMD RembrandtAMD CezanneAMD RenoirAMD PicassoAMD Raven Ridge
Family BrandingTBDRyzen AI 400TBDTBDRyzen AI 300Ryzen AI 300AMD Ryzen 8040 (H/U-Series)AMD Ryzen 7045 (HX-Series)AMD Ryzen 7040 (H/U-Series)AMD Ryzen 6000
AMD Ryzen 7035
AMD Ryzen 5000 (H/U-Series)AMD Ryzen 4000 (H/U-Series)AMD Ryzen 3000 (H/U-Series)AMD Ryzen 2000 (H/U-Series)
Process NodeTBD4nm4nm5nm4nm4nm4nm5nm4nm6nm7nm7nm12nm14nm
CPU Core ArchitectureZen 6?Zen 5 + Zen 5CZen 5Zen 5Zen 5 + Zen 5CZen 5 + Zen 5CZen 4 + Zen 4CZen 4Zen 4Zen 3+Zen 3Zen 2Zen +Zen 1
CPU Cores/Threads (Max)TBD12/248/1616/3216/3212/248/1616/328/168/168/168/164/84/8
L2 Cache (Max)TBD12 MBTBDTBD24 MB12 MB4 MB16 MB4 MB4 MB4 MB4 MB2 MB2 MB
L3 Cache (Max)TBD24 MB + 16 MB SLC32 MBTBD64 MB + 32 MB SLC24 MB16 MB32 MB16 MB16 MB16 MB8 MB4 MB4 MB
Max CPU ClocksTBDTBDTBDTBDTBD5.1 GHzTBD5.4 GHz5.2 GHz5.0 GHz (Ryzen 9 6980HX)4.80 GHz (Ryzen 9 5980HX)4.3 GHz (Ryzen 9 4900HS)4.0 GHz (Ryzen 7 3750H)3.8 GHz (Ryzen 7 2800H)
GPU Core ArchitectureRDNA 3+ iGPURDNA 3.5 4nm iGPURDNA 3+ 4nm iGPURDNA 3+ 4nm iGPURDNA 3.5 4nm iGPURDNA 3.5 4nm iGPURDNA 3 4nm iGPURDNA 2 6nm iGPURDNA 3 4nm iGPURDNA 2 6nm iGPUVega Enhanced 7nmVega Enhanced 7nmVega 14nmVega 14nm
Max GPU CoresTBD16 CUs (1024 Cores)12 CUs (786 cores)2 CUs (128 cores)40 CUs (2560 Cores)16 CUs (1024 Cores)12 CUs (786 cores)2 CUs (128 cores)12 CUs (786 cores)12 CUs (786 cores)8 CUs (512 cores)8 CUs (512 cores)10 CUs (640 Cores)11 CUs (704 cores)
Max GPU ClocksTBD2900 MHzTBDTBDTBD2900 MHz2800 MHz2200 MHz2800 MHz2400 MHz2100 MHz1750 MHz1400 MHz1300 MHz
TDP (cTDP Down/Up)TBD15W-45W (65W cTDP)15W-45W (65W cTDP)55W-75W (65W cTDP)55W-125W15W-45W (65W cTDP)15W-45W (65W cTDP)55W-75W (65W cTDP)15W-45W (65W cTDP)15W-55W (65W cTDP)15W -54W(54W cTDP)15W-45W (65W cTDP)12-35W (35W cTDP)35W-45W (65W cTDP)
Launch2026?2025?2025?2H 2024?2H 2024?2H 2024Q1 2024Q1 2023Q2 2023Q1 2022Q1 2021Q2 2020Q1 2019Q4 2018
Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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