AMD's Ryzen AI 300 APUs within the Strix Point and Krackan Point lineup have been detailed with 8-core models reserved for mainstream or "PRO" variants.
AMD's Krackan Point APUs To Cater To The Mid-Segment Of The Markets With 8 CPU & 8 GPU Cores, Strix 8-Core Limited To Ryzen AI 300 PRO APU Models But Come With 12 GPU Cores
There's a bit of confusion surrounding how AMD is planning to stack up its latest Ryzen AI 300 APUs, but it looks like we finally have some sort of clarity now.
Just recently, we witnessed AMD's Ryzen AI 7 PRO 360 APU surfacing up on Geekbench with its performance numbers, and through that, it was deduced that the APU is expected to be featured in the "Krackan Point" series, but according to a new leak by Golden Pig Upgrade at Weibo, it is now revealed that Team Red plans to position Ryzen AI 7 APUs with Krackan Point, and this doesn't include the "PRO" models.
To make things clear, AMD's Krackan Point APUs will include up to 8 CPU & 8 GPU core models with up to Ryzen AI 7 variants. The 8-core APUs such as the Ryzen AI 7 PRO 360 are not Krackan models since it comes with 12 Compute Units and this configuration is specific to certain "Strix Pro" SKUs. It is also mentioned in another leak that AMD's Strix Pro offerings will scale up to the Ryzen AI 9 HX Pro 375 APU which is exclusive to HP also exclusive got the Ryzen AI 9 HX 375, a model that is equipped with the fastest "55 TOPS" NPU on the market.
AI 9 HX PRO 3️⃣7️⃣5️⃣
<HP only>— Hoang Anh Phu (@AnhPhuH) September 16, 2024
AMD's Krackan Point APUs are set to target the more "affordable" segment of the industry, likely targeting handhelds and OEM machines. With this particular series, AMD intends to segregate its mid-tier APUs into a separate naming scheme, allowing a more efficient integration, especially for manufacturers. The lineup is said to offer an 8-core configuration with a 4x Zen 5 and 4x Zen 5c combination, along with eight compute units (RDNA 3.5) and up to 50 AI TOPS of compute power.
AMD Ryzen AI HX Krackan Point Expected Features:
- Zen 5 Monolithic Design
- Up To 8 Cores (4x Zen 5 + 4x Zen 5C)
- 16 MB of Shared L3 cache
- 8 RDNA 3.5 Compute Units
- LPDDR5X+DDR5 Support
- XDNA 2 Engine Integrated
- Up To 50 AI TOPS
- 1H 2025 Launch
- FP8 Platform (15W-45W)
It would not be wrong to say that the company's existing "Ryzen AI 300" APUs are just a trailer in terms of the capabilities it has brought into the mobile segment. With the upcoming Krackan Point and Strix Halo APUs, we will see the firm in full force, not just in terms of the raw power they will bring on board but also in terms of the ease of integration and utilization for both consumers and manufacturers.
The naming scheme might get mixed up, but given the way we adopted Intel's Meteor Lake and the "awkward" convention, we won't have much trouble with AMD. In terms of the release dates, AMD's Strix Halo and Krackan Point SKUs are expected to debut by somewhere next year, and the CES 2025 window does seem like the right time.
AMD Ryzen Mobility CPUs:
| CPU Family Name | AMD Sound Wave? | AMD Bald Eagle Point | AMD Krackan Point | AMD Fire Range | AMD Strix Point Halo | AMD Strix Point | AMD Hawk Point | AMD Dragon Range | AMD Phoenix | AMD Rembrandt | AMD Cezanne | AMD Renoir | AMD Picasso | AMD Raven Ridge |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Family Branding | TBD | Ryzen AI 400 | TBD | TBD | Ryzen AI 300 | Ryzen AI 300 | AMD Ryzen 8040 (H/U-Series) | AMD Ryzen 7045 (HX-Series) | AMD Ryzen 7040 (H/U-Series) | AMD Ryzen 6000 AMD Ryzen 7035 | AMD Ryzen 5000 (H/U-Series) | AMD Ryzen 4000 (H/U-Series) | AMD Ryzen 3000 (H/U-Series) | AMD Ryzen 2000 (H/U-Series) |
| Process Node | TBD | 4nm | 4nm | 5nm | 4nm | 4nm | 4nm | 5nm | 4nm | 6nm | 7nm | 7nm | 12nm | 14nm |
| CPU Core Architecture | Zen 6? | Zen 5 + Zen 5C | Zen 5 | Zen 5 | Zen 5 + Zen 5C | Zen 5 + Zen 5C | Zen 4 + Zen 4C | Zen 4 | Zen 4 | Zen 3+ | Zen 3 | Zen 2 | Zen + | Zen 1 |
| CPU Cores/Threads (Max) | TBD | 12/24 | 8/16 | 16/32 | 16/32 | 12/24 | 8/16 | 16/32 | 8/16 | 8/16 | 8/16 | 8/16 | 4/8 | 4/8 |
| L2 Cache (Max) | TBD | 12 MB | TBD | TBD | 24 MB | 12 MB | 4 MB | 16 MB | 4 MB | 4 MB | 4 MB | 4 MB | 2 MB | 2 MB |
| L3 Cache (Max) | TBD | 24 MB + 16 MB SLC | 32 MB | TBD | 64 MB + 32 MB SLC | 24 MB | 16 MB | 32 MB | 16 MB | 16 MB | 16 MB | 8 MB | 4 MB | 4 MB |
| Max CPU Clocks | TBD | TBD | TBD | TBD | TBD | 5.1 GHz | TBD | 5.4 GHz | 5.2 GHz | 5.0 GHz (Ryzen 9 6980HX) | 4.80 GHz (Ryzen 9 5980HX) | 4.3 GHz (Ryzen 9 4900HS) | 4.0 GHz (Ryzen 7 3750H) | 3.8 GHz (Ryzen 7 2800H) |
| GPU Core Architecture | RDNA 3+ iGPU | RDNA 3.5 4nm iGPU | RDNA 3+ 4nm iGPU | RDNA 3+ 4nm iGPU | RDNA 3.5 4nm iGPU | RDNA 3.5 4nm iGPU | RDNA 3 4nm iGPU | RDNA 2 6nm iGPU | RDNA 3 4nm iGPU | RDNA 2 6nm iGPU | Vega Enhanced 7nm | Vega Enhanced 7nm | Vega 14nm | Vega 14nm |
| Max GPU Cores | TBD | 16 CUs (1024 Cores) | 12 CUs (786 cores) | 2 CUs (128 cores) | 40 CUs (2560 Cores) | 16 CUs (1024 Cores) | 12 CUs (786 cores) | 2 CUs (128 cores) | 12 CUs (786 cores) | 12 CUs (786 cores) | 8 CUs (512 cores) | 8 CUs (512 cores) | 10 CUs (640 Cores) | 11 CUs (704 cores) |
| Max GPU Clocks | TBD | 2900 MHz | TBD | TBD | TBD | 2900 MHz | 2800 MHz | 2200 MHz | 2800 MHz | 2400 MHz | 2100 MHz | 1750 MHz | 1400 MHz | 1300 MHz |
| TDP (cTDP Down/Up) | TBD | 15W-45W (65W cTDP) | 15W-45W (65W cTDP) | 55W-75W (65W cTDP) | 55W-125W | 15W-45W (65W cTDP) | 15W-45W (65W cTDP) | 55W-75W (65W cTDP) | 15W-45W (65W cTDP) | 15W-55W (65W cTDP) | 15W -54W(54W cTDP) | 15W-45W (65W cTDP) | 12-35W (35W cTDP) | 35W-45W (65W cTDP) |
| Launch | 2026? | 2025? | 2025? | 2H 2024? | 2H 2024? | 2H 2024 | Q1 2024 | Q1 2023 | Q2 2023 | Q1 2022 | Q1 2021 | Q2 2020 | Q1 2019 | Q4 2018 |
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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