AMD is ending its HS, H & U branding which helped distinguish between Ryzen Mobile CPUs & adopting the "Ryzen AI" naming convention across all next-gen SKUs starting Strix Point.
AMD "Ryzen AI" Branding To Be Used Across All Next-Gen 15-45W Mobile CPUs Starting Strix Point Marking The End of HS, H & U Series
In a previous post, we reported how AMD was going to go all in on the "Ryzen AI" branding for its future APUs such as Strix Point and its derivatives. Now, Lenovo China's manager at Weibo seems to agree with this information and has said that AMD is going to end the HS, H, & U series branding which it formulated several years ago and recently updated with its Ryzen 7040 "Phoenix" chips in 2022.
Please note that starting from Strix Point, AMD will no longer distinguish between U, HS, and H, but will use one SKU to take over the standard TDP 15W-45W. This will help reduce the complexity of operation and testing, but for users , we cannot simply distinguish the performance release levels of different laptops through U/HS/H. Everyone must keep their eyes open. The name of HX will be retained, but as you can see, the current HX is not the definition of HX in the past.
via Weibo
Currently, AMD offers its mobile Ryzen CPUs in four segments, the high-end HX (55W+), standard HS & H (35W+), and low-power U (15-28W) chips. This naming scheme was adopted in the Ryzen 7000 series which included five different CPU families such as Dragon Range (Ryzen 7045), Phoenix (Ryzen 7040), Rembrandt Refresh (Ryzen 7035), Barcelo Refresh (Ryzen 7030) & the entry-level Mendocino (Ryzen 7020) series.
All of these families and the resultant Ryzen chips target a range of market segments. The most recent CPU entrant to make use of this naming scheme is the Hawk Point (Ryzen 8040) series.
But as we mentioned last time, AMD is diving heavily into the AI PC segment & that has prompted the company to make significant branding changes. The new naming scheme will be called "Ryzen AI" and the first generation will use the 100 series numbering. This is similar to Intel's Core Ultra 100 lineup which kicked off with the "Meteor Lake" family. One thing that the new naming scheme might make it difficult for consumers to understand would be the actual TDP configuration of the new chips.
For example, consumers can tell between the U, H, HS, and HX families as to what performance tier they are rated at. With the upcoming AMD "Ryzen AI" family, the company is going to use the "HX" tag on certain SKUs but these aren't necessarily the new "Fire Range" parts but rather the follow-ups to existing HS/H chips. So buyers might have to check the specific CPU specifications first when buying new laptops as you can get a 15-28W chip when you were supposed to get a higher-tier 35W+ variant.
Well, the AMD "Ryzen AI" branding hasn't been made official yet but leaks have already exposed such naming convention. We can expect that AMD will try its best to facilitate consumers & laptop buyers by helping them figure out the proper configuration through this naming scheme so let's hope that's the case.
AMD Ryzen AI 300 "Strix/Krackan" APUs:
| CPU Name | Cores / Threads | Core Config | Clock Speeds (Max) | Cache (Total) | AI Capabilities | iGPU | TDP |
|---|---|---|---|---|---|---|---|
| Ryzen AI 9 HX 375 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 85 AI TOPs (55 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX PRO 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 365 | 10/20 | 4x Zen 5 / 6x Zen 5C | 2.0 / 5.0 GHz | 30 MB / 20 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 PRO 360 | 8/16 | 3x Zen 5 / 5x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 72 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 350 | 8/16 | 4x Zen 5 / 4x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 66 AI TOPs (50 TOPS NPU) | Radeon 860M (8 CU @ 3.0 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 340 | 6/12 | 3x Zen 5 / 3x Zen 5C | 2.0 / 4.8 GHz | 22 MB / 16 MB L3 | 59 AI TOPs (50 TOPS NPU) | Radeon 840M (4 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 330 | 4/8 | 1x Zen 5 / 3x Zen 5C | 2.0 / 4.5 GHz | 12 MB / 8 MB L3 | 50 TOPS (NPU) | Radeon 820M (2 CU @ 2.8 GHz) | 28W (cTDP 15-54W) |
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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