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Semiconductor
Page 3 of 18
Japan’s Semiconductor Gas Production Collapses To Zero After China Cuts Off Tungsten, Leaving TSMC, SK Hynix And Samsung Exposed
AWS Graviton5 CPUs Now Available: Purpose-Built For AI With 25% Performance Uplift, 192 Cores, DDR5-8800 & PCIe Gen6 Support
TSMC’s 3nm Wafer Supply Remains Constrained For AI Customers, Even After Monthly Production Reaches New Milestone Of 175,000 Units
Intel Doubles Down on 14A as Cadence Signs Multi-Year Pact to Co-Optimize the Foundry’s “Crown Jewel” Process Tech
RTX Spark Features Altered Cortex-X925 Cores, Die Analysis Shows Attributes Taken From Dimensity 9400 & Dimensity 9500 Specifically To Tackle PC Workloads
RTX Spark To Encourage Industry Towards Lighter Laptops With Less Bulky Cooling Solutions, As Surface Laptop Ultra Targets A 110W TDP
Qualcomm’s Split 2nm Chipset Strategy Is Paying Off, But That’s Bad News For Its Rival MediaTek
Qualcomm Could Give Samsung Preferential Treatment For Its Snapdragon SoCs By Lowering Prices By 16% As It Views Exynos As A Greater Threat
Qualcomm Executive Is “Excited” For The RTX Spark’s Arrival And Wants To Welcome It To the New Family Of SoCs That’s “Growing Outside Of x86”
RTX Spark Once Again Hinted To Have A Surprisingly Powerful GPU, With A Laptop Featuring The SoC Running Alan Wake 2 With Ray Reconstruction Enabled
RTX Spark Gives Decent First Impression Of Its Performance In Developer Workloads Benchmark, Beats M5 By 54%, Marginally Slower Than Base M5 Pro
RTX Spark To Jumpstart New Lineup As NVIDIA Will Expand With Vera Rubin Spark & Rosa Feynman Spark Architectures With LPDDR6 RAM Support, Arriving 2027 Onwards
TSMC Now Pays Its Biggest Customer NVIDIA, Pulling CUDA-X Into the Fab to Slash Lithography Costs by Up to 50%
Qualcomm’s Snapdragon C Is Hiding A Nasty Secret That, If Proven, Will Make The MacBook Neo And Its A18 Pro Roar In Popularity
Qualcomm May Once Again Command A Higher Share Of Snapdragon SoCs Found In The Galaxy S27 Series, And It’s Thanks To One Clever Strategy
Snapdragon C Is Proof That Qualcomm Is Serious To Take On The MacBook Neo, But Its Partners Aren’t; By The Time They Are, It’ll Be Too Late
Exynos 2600’s Heat Pass Block Performs Better Than A Liquid-Nitrogen-Cooled Snapdragon 8 Elite Gen 5, Enabling Practical Uses For Future SoCs
An M1 Max Was “Transplated” To A Donor Board Using Skilled Hands, Knowledge And Patience, Giving A MacBook Pro A New Lease On Life
Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore’s Law Itself — And A Top Chip Analyst Isn’t Buying It
NVIDIA’s Vera CPU With 88 Olympus “Arm” Cores Outperforms AMD EPYC & Intel Xeon In First Benchmarks
Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations
Intel Foundry’s Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates
Samsung Leapfrogs Toward 1000-Layer NAND With First 900-Layer V-NAND Prototype, Stacking Two 450-Layer Cells Into One
Huawei Planning To Launch Chip Lithography Equal To TSMC’s 1.4nm Process By 2031, Showing That U.S. Sanctions Won’t Stifle Its Progress
Huawei Adopts “LogicFolding Design” Technology For Its Future Kirin Chipsets, Enabling All Sorts Of Perks Like Boosting Density By 53%, Clock Speeds By 12.7% & More
Exynos 2700 Can Brew Trouble For Both TSMC And Qualcomm Next Year, But Samsung Has To Go The Extra Mile For That To Happen
Xiaomi Getting Serious About Custom Silicon, Projects XRING Series To Be A Part Of $28 Billion Investment For The Next 5 Years
Apple’s A20 And A20 Pro Will Have One Huge Advantage Besides The 2nm Process To Help Achieve A New Record In Battery Life & Performance
Intel’s Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 Rollout
Alibaba Targets NVIDIA’s Hopper With Zhenwu M890 AI Chip, Claiming 3x The H20 Performance, 144GB HBM3 & A Roadmap Through 2028
Android Chipset Makers Are Losing Millions Of Dollars By Failing To Adopt An Apple Strategy Practiced Since The Original iPad Launch
TSMC Goes Full Throttle On Ultra-Advanced Nodes, Leaving Samsung In The Dust As It Begins Plans For 1nm Production
Xiaomi Executive Confirms The In-House XRING 03 Will Arrive This Year, But A Technological Disadvantage Could Make Its Launch Meaningless
Exynos 2700 To Receive Premium Treatment From Samsung As Update Drops Claims Of Company Abandoning Its 2nm SoC’s Advanced Packaging
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