Micron has started mass production of its HBM3e memory, as the standard receives mass adoption from firms like NVIDIA for H200 AI GPUs.
Micron's HBM3e Solution Promises Exceptional Performance, Catering To The Growth of AI Solutions & Powering NVIDIA's H200 AI Juggernaut
[Press Release]: Micron Technology, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron's 24 GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024.
This milestone positions Micron at the forefront of the industry, empowering artificial intelligence (AI) solutions with HBM3E's industry-leading performance and energy efficiency. As the demand for AI continues to surge, the need for memory solutions to keep pace with expanded workloads is critical.
Micron's HBM3E solution addresses this challenge head-on with:
- Superior Performance: With pin speed greater than 9.2 gigabits per second (Gb/s), Micron's HBM3E delivers more than 1.2 terabytes per second (TB/s) of memory bandwidth, enabling lightning-fast data access for AI accelerators, supercomputers, and data centers.
- Exceptional Efficiency: HBM3E leads the industry with ~30% lower power consumption compared to competitive offerings. To support increasing demand and usage of AI, HBM3E offers maximum throughput with the lowest levels of power consumption to improve important data center operational expense metrics.
- Seamless Scalability: With 24 GB of capacity today, HBM3E allows data centers to seamlessly scale their AI applications. Whether for training massive neural networks or accelerating inferencing tasks, Micron's solution provides the necessary memory bandwidth.
Micron developed this industry-leading HBM3E design using its 1-beta technology, advanced through-silicon via (TSV), and other innovations that enable a differentiated packaging solution. Micron, a proven leader in memory for 2.5D/3D-stacking and advanced packaging technologies, is proud to be a partner in TSMC's 3DFabric Alliance and to help shape the future of semiconductor and system innovations.
Micron is delivering a trifecta with this HBM3E milestone: time-to-market leadership, best-in-class industry performance, and a differentiated power efficiency profile. AI workloads are heavily reliant on memory bandwidth and capacity, and Micron is very well-positioned to support the significant AI growth ahead through our industry-leading HBM3E and HBM4 roadmap, as well as our full portfolio of DRAM and NAND solutions for AI applications.
- Sumit Sadana, Executive VP and chief business officer at Micron Technology
Micron is also extending its leadership with the sampling of 36 GB 12-High HBM3E, which is set to deliver greater than 1.2 TB/s performance and superior energy efficiency compared to competitive solutions, in March 2024. Micron is a sponsor at NVIDIA GTC, a global AI conference starting March 18, where the company will share more about its industry-leading AI memory portfolio and roadmaps.
HBM Memory Specifications Comparison
| DRAM | HBM1 | HBM2 | HBM2e | HBM3 | HBM3E | HBMNext (HBM4) |
|---|---|---|---|---|---|---|
| I/O (Bus Interface) | 1024 | 1024 | 1024 | 1024 | 1024-2048 | 1024-2048 |
| Prefetch (I/O) | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum Bandwidth | 128 GB/s | 256 GB/s | 460.8 GB/s | 819.2 GB/s | 1.2 TB/s | 1.5 - 2.56 TB/s |
| DRAM ICs Per Stack | 4 | 8 | 8 | 12 | 8-16 | 8-16 |
| Maximum Capacity | 4 GB | 8 GB | 16 GB | 24 GB | 24 - 36 GB | 36-64 GB |
| tRC | 48ns | 45ns | 45ns | TBA | TBA | TBA |
| tCCD | 2ns (=1tCK) | 2ns (=1tCK) | 2ns (=1tCK) | TBA | TBA | TBA |
| VPP | External VPP | External VPP | External VPP | External VPP | External VPP | TBA |
| VDD | 1.2V | 1.2V | 1.2V | TBA | TBA | TBA |
| Command Input | Dual Command | Dual Command | Dual Command | Dual Command | Dual Command | Dual Command |
News Source: Micron
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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