The M5 was announced back in October 2025, but Apple is just getting warmed up because it has plans to launch the M5 Pro, M5 Max, and M5 Ultra in the first half of 2026. Though the first two higher-end chipsets have been reported to launch around the time the company releases its macOS 26.3, it is the iOS 26.3 Beta that contains evidence of these SoCs. However, the release candidate only mentions two of the three silicon, casting a shadow of doubt in our minds as we discuss the details below.
The M5 Pro wasn’t mentioned in the iOS 26.3 Beta, but that doesn’t mean Apple won’t push forward with a launch
The two unreleased chipsets belonging to the M5 are T6051 and T6052, with MacRumors and Nicolás Alvarez digging around to learn that these are associated with the H17C and H17D platform names. The number’ 17’ indicates a relationship with the M5 series, with the base version numbered H17G. Based on the latest information, the M5 Ultra is associated with the letter’ D,’ with the M5 Max identified with the letter ‘C.’ The M5 Pro, which has not been found in the evidence, would feature the unique identifier H17S.
- M5 Pro - T6050, H17S (not mentioned in iOS 26.3 Beta)
- M5 Max - T6051, H17C (mentioned in iOS 26.3 Beta)
- M5 Ultra - T6052, H17D (mentioned in iOS 26.3 Beta)
There are a couple of possibilities here; Apple could add the M5 Pro to its iOS 26.3 code, because in terms of ‘performance per cost,’ this chipset offers the most value and is only second to the M5 in terms of popularity. Even now, the 14-inch M4 Pro MacBook Pro with a 12-core CPU, 16-core GPU, 24GB unified RAM, and a 512GB SSD is going for $1,749.99 on Amazon. Seeing top-tier hardware available at a substantial discount is a rarity, especially during the DRAM crisis.
As for the second possibility, Apple may not launch an M5 Pro at all, proceeding to unveil only the M5 Max and M5 Ultra, which we personally believe won’t happen. The M5 Pro and M5 Max have previously been rumored to launch in March, with the new Small Outline Integrated Circuit Molding-Horizontal (SoIC-MH) packaging helping to reduce manufacturing costs while also improving heat dissipation.
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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