- 0-20%: Unlikely - Lacks credible sources
- 21-40%: Questionable - Some concerns remain
- 41-60%: Plausible - Reasonable evidence
- 61-80%: Probable - Strong evidence
- 81-100%: Highly Likely - Multiple reliable sources
50%
Plausible
The month of January is at its end, and those eagerly waiting for the M5 Pro and M5 Max launches have so far been disappointed that Apple hasn’t announced any high-end chipset for the latest generation. Even though a previous report mentioned that we should expect the new SoCs in the first half of 2026, the latest rumor claims that we won’t have to wait too long, as the M5 Pro and M5 Max could arrive in the month of March. Additionally, Apple is said to switch the packaging of its new silicon to Small Outline Integrated Circuit (SoIC), which, a tipster claims, will help reduce manufacturing costs, giving the company a breather during the DRAM shortage.
The new Small Outline Integrated Circuit packaging for the M5 Pro and M5 Max has been talked about previously, with this transition possibly helping Apple to lower both chipsets’ temperatures
With the top-end M4 Max MacBook Pro models witnessing an insanely long waiting period, it was concrete evidence that the M5 Pro and M5 Max launches were right around the corner. Unfortunately, you’ll need to do a little more waiting because Weibo’s Fixed-focus digital cameras has commented that the SoCs are expected a month from now. The rumor does not go into detail about why the M5 Pro and M5 Max are arriving much later, given that the M6 could launch a little earlier than previously anticipated, but the reason likely has to do with supply constraints from TSMC’s side.
Additionally, the SoIC packaging may have witnessed some production issues, but based on Fixed-focus digital cameras’ claims, the M5 Pro and M5 Max could be less expensive to manufacture, but not by much. Still, any savings are a welcome affair given that every entity is battling with the DRAM crisis. The SoIC packaging may also enable Apple to overcome some of the temperature problems encountered by the M5, as we have reported that the chipset can reach 99 degrees Celsius when pushed hard.
However, perhaps the most significant benefit of SoIC is that it could enable the M5 Pro and M5 Max to have separate CPU and GPU blocks on the die, allowing for unique configurations depending on the workload carried out by the user. Of course, it is essential to treat this rumor with a pinch of salt and wait for more details, as Apple could deliver an unexpected surprise to us at any time. With that being said, let us keep our fingers crossed.
News Source: Fixed-focus digital cameras
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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