Samsung is no stranger to introducing new packaging technologies for its Exynos lineup of chipsets that help enable improved performance, efficiency, and lowered thermals. The company started off by bringing ‘Fan-out Wafer Level Packaging’ (FOWLP) to the Exynos 2400, making it the first silicon to adopt it, followed by ‘Heat Pass Block’ (HPB) to its first 2nm GAA SoC, the Exynos 2600. Now, the latest report states that the Korean giant is developing a new structure called ‘side by side’ (Sb), which will be applied to a future Exynos version. Here’s how it differs from the previous technologies and how it could be beneficial.
With the ‘side by side’ packaging, Samsung’s new Exynos SoCs can have their dies horizontally-positioned, with the DRAM next to it, followed by a Heat Pass Block
By placing the chipset die and DRAM side-by-side with the HPB on top of both components, heat can be dissipated much faster by the two components, leading to better temperatures. Another advantage here is that the thickness of the chipset package is reduced, meaning that if Samsung ever decides to resurrect its Galaxy S26 Edge using a different name, it can utilize the SbS packaging.
Additionally, companies that wish to pursue thinner smartphone releases can also opt for this packaging, assuming they appease the company by placing orders on Samsung’s 2nm GAA process. The Korean technology behemoth was earlier reported to be testing the Exynos 2600 for the upcoming Galaxy Z Flip 8, so it is unlikely that SbS packaging will make its debut in the clamshell foldable, but the company may have a change of plans since this packaging will benefit smartphones sporting a thinner form factor, as mentioned previously.
So far, there is no confirmation that development work is carried out on the Exynos 2700, but there’s a strong chance that the latter becomes a recipient of SbS. As for the Exynos 2800, which could be Samsung’s first silicon to rock a GPU that’s made entirely in-house, we have a strong feeling that this next-generation chipset could adopt the new packaging. After all, the silicon is expected to be utilized in more than just smartphones, making the use of SbS much more effective.
News Source: ZDNet
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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