Samsung’s recent announcement of the Exynos 2600 is proof that the company’s 2nm GAA process has achieved healthy yield stability. With the company finally establishing a solid foundation for its next-generation lithography, it is time to move forward with the second-generation version, also known as SF2P. This technology is expected to be used for the Korean giant’s upcoming Exynos 2700, and here’s everything you need to know about the cutting-edge silicon, from its specifications, architecture, and right down to its estimated launch.
How big an improvement will Samsung’s SF2P process bring for the Exynos 2700?
The differences between Samsung’s SF2 and SF2P manufacturing processes have been listed below, with the second-generation 2nm GAA node acting as a slightly improved variant of the first iteration, much like TSMC’s 2nm N2 and N2P. In short, the Exynos 2700 is going to be a more capable version of the Exynos 2600, and that’s always a positive thing.
- 12 percent performance improvement over SF2
- 25 percent power reduction over SF2
- 8 percent area reduction over SF2
While some may assume the Exynos 2700 is an iterative update of the Exynos 2600, it is expected to support the newest technological standards, which we’ve discussed below, making it more than an immediate successor.
Specifications
There haven’t been any reports of Samsung switching to in-house CPU cores like Qualcomm’s Oryon series for the Exynos 2700, meaning that it will likely stick with ARM’s C2 CPU designs. Unfortunately, don’t expect a custom GPU either because Samsung is reported to introduce this solution with the Exynos 2800. Regardless, the graphics processor might be called the Xclipse 970, and given that the Exynos 2600’s Xclipse 960 is based on a modified version of ARM’s RDNA 4 architecture, the newer GPU could be based on RDNA 5.
Additionally, we should prepare ourselves for the Exynos 2700 supporting the latest technological standards, such as LPDDR6 RAM and UFS 5.0 storage, but that depends on whether Samsung’s Mobile Experience division will adopt these in the Galaxy S27 family. As for the CPU cluster, an older benchmark leak revealed that Samsung was testing a ‘4 + 1 + 4 + 1’ configuration, which is the strangest loadout we’ve seen.
However, these are likely subject to change because notable tipster Ice Universe has said that Samsung tests a mix of older and newer CPU cores for optimization and scheduling purposes. Since the company has several months to finalize fresh specifications, it is best to treat these details with a pinch of salt.
As for the thermals, Samsung has already implemented its Heat Pass Block (HPB) on the Exynos 2600, but there could be an even better solution getting prepared for the Exynos 2700. A new heat dissipation solution called ‘side by side’ (Sb) could be incorporated in the Exynos 2700. This approach places the individual dies horizontally rather than stacked, and with Samsung’s HPB included to reduce temperatures, the silicon can deliver faster speeds and sport a thinner package to help conserve valuable space.
Launch
Based on the predictions of Kiwoom Securities analyst Park Yu-ak, the Exynos 2700 will enter mass production in the second half of 2026, meaning that it could share the same announcement timeline as the Exynos 2600. It is also possible that Samsung increases the total shipments share of the Exynos 2700 found in the Galaxy S27 family to 50 percent, up from 25 percent on the Galaxy S26.
Not only will this move cement a powerful belief that Samsung is highly confident in its in-house solutions, but its overall chipset expenditure due to sourcing SoCs from Qualcomm will be significantly reduced, with the Exynos 2700 boosting operating profit significantly.
