- 0-20%: Unlikely - Lacks credible sources
- 21-40%: Questionable - Some concerns remain
- 41-60%: Plausible - Reasonable evidence
- 61-80%: Probable - Strong evidence
- 81-100%: Highly Likely - Multiple reliable sources
50%
Plausible
Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make its upcoming Galaxy S27 series more affordable for the masses amid the DRAM shortage. Fortunately, a new rumor has dispelled these claims, stating that the Korean giant fully intends to treat its next 2nm chipset with the best in-house technologies possible to raise the competitive bar.
Maintaining FOWLP technology on the Exynos 2700 helps the latter to maintain better performance when running taxing workloads
Aside from removing FOWLP from the Exynos 2700, Samsung was also rumored to switch to BOE’s OLEDs for the base Galaxy S27 to reduce its component costs. According to @SPYGO19726, the next flagship SoC from the company to leverage its second-generation 2nm GAA process won’t witness any trade-offs, meaning that it won’t just be treated to Samsung’s cutting-edge lithography but will have all sorts of additions to help it compete against the Snapdragon 8 Elite Gen 6 Pro and Dimensity 9600 Pro.
Interestingly, @SPYGO19726 remarks that the report from which this information originated has ulterior motives, likely to tarnish Samsung’s goodwill. With the company raking in record profits, employees want a piece of the Korean firm’s stellar earnings, but Samsung’s refusal has forced a strike of epic proportions, causing an operations halt that threatens to put South Korea’s economy at risk.
While we cannot confirm the following, it’s possible that this alleged false information was somehow disseminated and reached Sisajournal, the Korean outlet that first reported about Samsung’s packaging-removing plans from the Exynos 2700. Fortunately, with this technology expected to be maintained, Samsung claims that FOWLP not only helps make chipsets 40 percent smaller, but they also boast 30 percent lower thickness while flaunting 16 percent improved thermal resistance.
With these attributes, the Exynos 2700 could deliver better sustained workloads when running intensive programs, with the new side-by-side (SBS) architecture helping keep both the CPU and DRAM cool by introducing a new heat transfer solution. The only drawback on paper is that FOWLP is costly to incorporate, and while @SPYGO19726 appears confident in his claims, Samsung could initiate a last-minute change to remove the packaging when the Exynos 2700 enters mass production later this year.
News Source: @SPYGO19726
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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