MediaTek Helio X30 To Come With 16nm FinFET Next Year

Ramish Zafar
Posted Nov 14, 2015
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With the mobile SoC race having taken an interesting turn over the past week, several manufacturers should be feeling the heat by now. Both Qualcomm and Samsung, in a move that is undoubtedly coordinated, launch the Snapdragon 820 and the Exynos 8890, raising the bar for top performing chipsets significantly in the process. Manufactured on Samsung’s 14nm FinFET, both the processors claim to offer significant performance boosts over their predecessors and unparalleled performance, at least on paper. Today we’ve managed to get some information about yet another processor that should make things even more interesting.

MediaTek’s Helio X30 To Be Manufactured On 16nm As Several Details Surface

With the launch of the Exynos 8890 and the Snapdragon 820 by Samsung and Qualcomm respectively, things have definitely started to ‘heat’ up in the mobile processor world. Both the chipsets have been in the news for quite a while with both the companies having quite a lot riding on them. For Qualcomm, the Snapdragon 820’s success is crucial after its predecessor managed to overheat and throttle quite a lot in high performance situations.

For Samsung, it gives the company an excellent chance to show off its 14nm FinFET to the maximum and try out custom cores on its chipset as well, a direction that more companies should be expected to head towards in the future as well. With all these advancements, other manufacturers should be coming under some pressure and it looks like MediaTek’s already got some plans underway.

The company’s Helio X20 managed to make quite a few headlines earlier with its unique 10 core architecture, that according to MediaTek helps the chipset manage power and performance load much more efficiently. The company already seems to have the Helio X20’s successor in the mix it seems, with some more details surfacing today.

MediaTek Helio X30 Official Specifications Revealed – Take A Look Right Here

The MediaTek Helio X30 will be manufactured on the 16nm FinFET process and will directly compete with the Huawei Kirin 950, according to company CEO Zhu Shangzu. In addition, the chipset will be launched by the manufacturer next year and will be coming with LPDDR4 support, coupled with UFS and 2Kx2K VR support also being thrown into the mix. These, coupled with the fact that the Helio X30 is also said to come with Cortex A35 cores on board, should make MediaTek’s SoC one of the top performing chipsets in the market. Thoughts? Let us know what you think in the comments section below and stay tuned for all the latest updates.

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