The newer 2nm process can continue to utilize the current EUV machines that TSMC has in place for mass producing wafers with a higher yield percentage, but as the Taiwanese semiconductor behemoth moves to sub-2nm nodes like 1.4nm and 1nm, also known as A14 and A10, respectively, it will run into manufacturing roadblocks. Now, this problem can easily be scaled with the purchase of ASML’s cutting-edge High-NA EUV machinery, but a new report states that instead of making the purchase, TSMC will move to photomask pellicles.
Photomask pellicles are expected to be less costly than purchasing a $400-million-dollar High-NA EUV machine, though TSMC will be moving to a ‘trial and error’ approach to improve production reliability
Full-scale production of 2nm wafers is expected to start by the end of 2025, after which, TSMC will eventually transition to the 1.4nm node. The company has already laid the foundations for jumping to the advanced manufacturing process, with production expected to start sometime in 2028. With an initial investment of a whopping NT$1.5 trillion, or approximately $49 billion, TSMC is already moving at lightning speed, with R&D of the 1.4nm process starting at the Hsinchu plant and the acquisition of 30 EUV machines.
However, one move that TSMC refuses to make is to purchase ASML High-NA EUV machines, which cost $400 million apiece. However, this equipment will ensure the reliability in manufacturing 1.4nm and 1nm wafers at a higher yield. The company likely believes that the dollar value attached to this hardware does not equate to its actual value, which is why, according to Dan Nystedt and Commercial Times, TSMC is moving to photomask pellicles instead. Processes of sub-2nm must have a pellicle in the mix to prevent dust and other particles from contaminating the procedure.
Again, this is a costly move that is accompanied by a great deal of complications. For instance, when producing 1.4nm and 1nm wafers using standard EUV machines, more exposure will be necessary, meaning that the photomask will be used often to achieve success, which can compromise yields. During this phase, the use of pellicles will be absolutely mandatory to prevent the aforementioned dust particles and contaminants from entering the wafer-manufacturing stage.
TSMC could stick with this approach because it believes it is a worthy alternative to forking over $400 million per High-NA EUV machine. Another drawback of High-NA EUV machines is that ASML can only produce between five and six of them annually, and with TSMC said to purchase 30 standard EUV machines to meet the mounting demand from a bevy of customers, including Apple, spending a lucrative sum on fewer units is an exercise in futility for its long-term goals.
News Source: Commercial Times
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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