TSMC To Buy 30 Hectares Land In Taiwan For 3nm Fabrication Plant

Oct 24, 2019
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Korean tech giant Samsung had a big day yesterday when it announced its second 7nm EUV based flagship SoC, the Exynos 990. The SoC features an octa-core CPU, with three core clusters. The first of these features four ARM Cortex A55, the second has two Cortex A76 cores and the third allegedly comes with two fifth-generation Mongoose M5 cores. Now, Taiwanese fab TSMC has announced plans for its 3nm process node. Take a look below for more details.

TSMC Will Acquire 30 Hectares In Taiwan's Hsinchu Industrial City & Build A 3nm Fabrication Facility

Reports for TSMC's decision to build a 3nm fabrication facility aren't new. It was reported in January last year that the company intends to construct this plant in South Taiwan after it had finished laying the foundation for 5nm fabrication. This report succeeded statements made by the company's spokesperson Elizabeth Sun to the Nikkei Asian Review where she highlighted on her company's ongoing efforts to find a piece of land that was sufficiently large and easily accessible for the new plant.

TSMC Optimistic About 5G Demand; Sets 2020 Capital Expenditure Between $14 Billion – $15 Billion

Now, we've got a report from MyDrivers' industry insiders suggesting that TSMC has finalized its land acquisition for the 3nm fab. According to the details, TSMC is set to finalize acquiring 30 hectares of land in South Taiwan, with the deal to be finalized by the end of this year. Once finalized, TSMC will construct a new facility to fabricate chips using 3nm. The company has already commenced 2nm research in Taiwan's Hsinchu industrial park, and 3nm mass production is expected to commence by 2022 according to an earlier report linked in this sentence.

TSMC's CEO C.C Wei

TSMC currently operates 13 facilities centered on fabricating chips and researching future technologies. Presently, TSMC intends to scale up 5nm fabrication next year. The company's latest high-end process node is the N7+, which uses extreme ultraviolet lithography for certain layers. It's been whispered on the Chinese social network Weibo that TSMC's been facing yield problems with the process, but so far, the company itself has not released any statements related to such difficulties.

5nm, referred to as N5 by TSMC will are expected to feature 173 million transistors per mm², effectively doubling density offered by the company's first-generation 7nm process. However, second-generation N5, referred to as N5P will feature front and back-end optimizations for either a 7% performance or 15% power efficiency gain.

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