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Samsung may observe cost-cutting for the Exynos 2700

Samsung’s RAM Shortage Struggles Claims Another Victim As Exynos 2700 To Witness One Trade-Off, Despite Being The Most Advanced 2nm SoC

Qualcomm and MediaTek have a stronger 2nm base to beat Apple this year

Qualcomm & MediaTek Have A Stronger 2nm Base To Beat Apple This Year, But Architectural Improvements Will Also Decide The Outcome

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

Snapdragon 8 Elite Gen 6 Pro could be Qualcomm's most expensive chipset to date

Snapdragon 8 Elite Gen 6 Pro To Be Out Of Reach For Many Of Qualcomm’s Partners, As 2nm Process Will Shoot Prices To Abnormal Levels

Qualcomm's and MediaTek's 2nm chipsets could be extremely costly this year

Qualcomm & MediaTek Are Obsessed With Closing The Performance Gap Against Apple, So Much So That Their 2nm SoCs Could Risk Mass Adoption

Loongson Targets Intel 12th Gen and Radeon RX 550 Performance With 3B6600 CPUs and 9A1000 GPUs Launching Next Year

Loongson Targets Intel 12th Gen and Radeon RX 550 Performance With 3B6600 CPUs and 9A1000 GPUs Launching Next Year

NVIDIA Squashes Vera Rubin Rumors, First Shipments Rolling Out In July To Major AI Customers With Mass Production In 2H 26

SMIC founder says it's a misconception to says that success can only be achieved when manufacturing 3nm or 2nm wafers

SMIC Founder Says It’s A “Misconception” That Semiconductor Success Is “Only Achieved When 3nm Or 2nm Is Reached” In New Interview

An individual in a leather jacket is presenting a large circuit board design next to a stack of horizontal units.

NVIDIA Rubin & Rubin Ultra Platforms Facing Design/Spec Issues As Per Rumors While AMD MI500 Positioned For 2H 2027 Launch

Qualcomm to offer various 2nm and 3nm chipset options this year

Qualcomm To Have A Stacked Chipset Lineup This Year, Offering Both Flagship 2nm And Lower-Tier 3nm Options To Offer Device Diversification

Apple and Intel logos on a blue digital background, glowing prominently.

Apple Taps Intel To Make Its Next-Gen Macbook Neo Chips, A21, The Competitor To x86 PCs

Google isn't moving to Snapdragon or Dimensity chipsets for the Pixel 12 series, reveal new leak

Google Staying Committed To Its Tensor Chips For The Pixel 12 Series As Details Of Next-Generation SoC Have Been Spilled

AMD MI430X Will Be The "Highest Performance" FP64 GPU Ever Built, Surpassing NVIDIA's Rubin By 6x For Classic HPC-Focused Data Centers

AMD MI430X Is The “Highest Performance” FP64 GPU Ever Built, Surpassing NVIDIA’s Rubin By 6x In Classic-HPC Workloads

A Samsung 2nm chip and an AMD EPYC processor are displayed against a blue cosmic background.

AMD Eyes Samsung 2nm Tech As Alternative In Tackling Wafer Supply Constraints With Talks In “Advanced Stages”

Google's Tensor chips can easily run Liquid Glass, but the company chooses not to

Pixel’s Tensor Chips Can Easily Handle Liquid Glass, But Google’s Approach Promises One Benefit, Preventing This UI Transition

Samsung testing a new Exynos chipset on its 1.4nm process

Samsung Testing Its Next-Generation Exynos On The 1.4nm Process, Initial Specifications Boast 96MB Of Cache, Higher Clock Speeds & More

Samsung Only Being Seen As A Backup Option For TSMC Instead Of Viable Alternative, Companies Only Opening Doors Due To Access To 2nm Technology

NVIDIA Feynman GPUs Push Power Semi Content To $191,000, 17 Times Increase Over Blackwell As Industry Pushes 800V DC Architectures

NVIDIA Feynman GPUs Push Power Semi Content To $191,000, 17 Times Increase Over Blackwell As Industry Embraces 800V DC Architectures

An NVIDIA chip labeled 'GH200 H100 NVL' is positioned centrally within a complex cooling system.

NVIDIA Fast-Forwarded Co-Packaged Optics Five Years Ahead of Schedule, Arriving First With Its Feynman GPUs

Intel's ZAM Memory Threatens HBM's AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints

Intel’s ZAM Memory Threatens HBM’s AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints

Sub-1nm Process Technlogy Won't Arrive Till 2034, IMEC Logic Roadmap Highlights 2DFETs For 0.2nm & Sub 0.2nm Nodes By 2043-2046

Sub-1nm Process Technology Won’t Arrive Till 2034, Logic Roadmap Highlights 2D FETs For 0.2nm & Sub 0.2nm Nodes By 2043-2046

TSMC’s A16 ‘1.6nm’ Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026

Agentic AI Pushes CPUs to Pack 400 GB of Memory, 4x More Than Today, as DRAM Shortage Spirals Toward 2027

Intel & AMD Work On APX, The Next Major Step In The Evolution of x86 Architectures, Adds More Performance Without Requiring More Die Area & Power

Intel & AMD Work On APX, The Next Major Step In The Evolution of x86 Architectures, Adds More Performance Without Requiring More Die Area & Power

Intel’s 18A-P Goes Beyond a 9% Speed Bump, Adding 50% Better Thermal Conductivity and Tighter Skew Corners to Win Foundry Customers

Intel Achieves A Phenomenal 90% EMIB Yield As Per Analyst, EMIB-M For Efficiency & EMIB-T For Massive ">12x Reticle" Packages In 2028 1

Intel’s EMIB Hits 90% Yield as Analyst Signals Foundry Breakthrough, EMIB-T Scales To >12x Reticle In 2028

Samsung says it's working on the Exynos 2700

Samsung Spills The Beans Of Its Next Flagship Chipset, The Exynos 2700, Claiming Its “Enhanced AI Performance” Can “Expand Market Share”

A presentation slide shows details about the 'Intel 18A' and 'Intel 18A-P' chips with performance and chip density metrics, and a timeline graph displaying defect density improvements, accompanied by a statement 'On Track for HVM Yield Levels In Q4'25.'

Intel’s 18A-P Pulls in Apple’s Next M Chips While EMIB Reportedly Wins Google TPUv8e As Customer Confidence Amps Up

Samsung's upscaling technology for the Exynos 2600 brings a 15 percent performance improvement

Samsung’s Own Version Of DLSS For The Exynos 2600 Promises 15% Higher Performance, But The Company’s Efforts Are Lacking In One Area

Samsung To Initiate Pilot Production Of Glass Substrates Semiconductor This Year

Intel-Backed “Glass Substrates” Tech Will Be Ready For Commercialization Within Three Years, Says Amkor Lead

HBF Memory Offers Higher Capacities Than HBM But NVIDIA Isn't Interested In It (Yet), Sampling This Year With Google A Key-Customer 1

NVIDIA Not Interested In HBF Memory Despite 4TB Stacks Dwarfing HBM, Google Reportedly Locked As Sampling Begins This Year

Google Is Reportedly A Major Intel Foundry Customer, Will Use EMIB Advanced Packaging For Next-Gen TPU

Google Is Reportedly A Major Intel Foundry Customer, Will Use EMIB Advanced Packaging For Next-Gen TPU

A17 Bionic and M3 chipsets

TSMC 3nm & 2nm Wafer Output To Be Boosted By 20% By The End of 2026 As Supply Crunch Continues

pim memory 2

Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Boosts Density By Up to 50%