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Intel AVX10 ISA To Feature AVX-512 Instructions With Support on Both P-Cores & E-Cores 1

Intel Alder Lake P-Core & E-Core Detailed: Golden Cove Offers 50% Higher Single-Threaded & Hybrid Design Offers 50% Higher Multi-Threaded Performance

IBM’s Next-Gen Z Processor Detailed: Telum Chip Based on 7nm Process, 22.5 Billion Transistors, 8 Cores Running Beyond 5 GHz Clocks

NVIDIA Hopper GPUs Featuring MCM Technology Rumored To Tape Out Soon

TSMC Roadmap Lays Out Advanced CoWoS Packaging Technologies, Ready For Next-Gen Chiplet Architectures & HBM3 Memory

Intel Xeon W9-3495 Sapphire Rapids HEDT CPU Spotted - Rocks 56 Cores, 112 Threads & a 1.80 GHz ES Clock Speed

Intel Sapphire Rapids-SP Xeon CPUs To Feature 4 8-Hi HBM2E Stacks, 14 EMIB Interconnects, Full XCC Die Measures Around 400mm2

AMD Discloses Its Multi-Layer Chiplet Design Era, Starting With Zen 3 With 3D Stacked V-Cache Technology

Samsung Beings 12nm DDR5 16 Gb DRAM Mass Production: Up To 7200 Mbps & 23% Efficient 1

Samsung Develops 512 GB DDR5 Memory Module With Speeds of Up To 7.2 Gbps, Mass Production By End of 2021

Intel Shows Its Tiger Lake CPU Die, Details What’s New & What’s The Same on It’s 11th Gen Mobility Lineup

Intel To Fire Back At AMD & Their Growing Server Market Share With The Ice Lake Processors

Intel Unveils 3rd Gen Ice Lake-SP Xeon CPU Family: 10nm+ Sunny Cove Cores, New Instructions, 28 Core Chip Showcased

Meet Cerebras WSE, The World’s Largest Chip At More Than 56 Times The Size Of An NVIDIA V100

AMD To Provide Architectural Deep-Dive Into 3rd Gen Ryzen CPUs With Zen 2 Cores and Navi GPUs at Hot Chips 2019

NVIDIA Volta Tesla V100 and AMD Vega 10 GPUs Detailed at Hot Chips 2017 – The Flagship Compute Powerhouses of Team Green and Red

NVIDIA’s Flagship Pascal GP100 GPU Die Shot Revealed at Hot Chips – The Biggest FinFET GPU To Date, Featuring HBM2 and NVLINK

AMD Opens The Lid on Zen Architectural Details at Hot Chips – Huge Performance Leap Over Excavator, Massive Throughput on 14nm FinFET Design

NVIDIA Unveils Tegra Parker SOC at Hot Chips – Built on 16nm TSMC Process, Features Pascal and Denver 2 Duo Architecture

SK Hynix and Samsung Talk HBM at Hot Chips 28 – Low Cost HBM, HBM2 and HBM3 In The Roadmap