Samsung’s Exynos 2600 Goes Toe-To-Toe With Qualcomm’s Snapdragon 8 Elite Gen 5 In Vulkan On Geekbench

Rohail Saleem
Exynos 2600's Xclipse 960 GPU beats the Snapdragon X Elite in Geekbench 6 OpenCL tests
Samsung Exynos 2600 finally solves a long-standing issue.

We've just received yet another material signal as to the potency and overall effectiveness of Samsung's Exynos 2600 chip, which is expected to launch within the upcoming Galaxy S26 series.

Samsung's Exynos 2600 matches the performance of Qualcomm's Snapdragon 8 Elite Gen 5 chip in Vulkan on Geekbench

As is evident from the X post above, Samsung's Exynos 2600 chip (Galaxy S26) has managed to snag a score of 27,478 on Vulkan, which is just a smidge shy of the score of 27,875 that Qualcomm's Snapdragon 8 Elite Gen 5 chip (Redmagic 11 Pro) has secured. Practically, the two chips are in performance-related parity on Vulkan.

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Meanwhile, as per a recent aggregation of Geekbench 6 OpenCL scores, the Exynos 2600's Xclipse 960 GPU exhibited a variation of just 3.4 percent between its lowest and highest scores, showing an overall remarkable level of consistency that Qualcomm's Snapdragon 8 Elite Gen 5 has failed to match so far.

This comes as a Galaxy S25+ equipped with the Exynos 2600 chip recently beat the Geekbench 6 OpenCL score of the Galaxy Book4 Edge, which is equipped with the Snapdragon X Elite, a chipset one would ordinarily assume to be significantly powerful. 

For the benefit of those who might not be aware, the Exynos 2600 is Samsung's first chip that leverages its 2nm Gate-All-Around (GAA) process, which is a 3D transistor architecture where the Gate completely surrounds the channel, which consists of vertically stacked nanosheets - on all four sides, resulting in improved electrostatic control and a lower voltage threshold.

The chipset is also equipped with the Xclipse 960 GPU, which is the first to leverage a customized version of AMD’s RDNA 4 architecture. 

As we explained in a dedicated post, the Exynos 2600 is Samsung’s first chipset to not just adopt Fan-out Wafer Level Packaging (FOWLP) but also incorporate its Heat Pass Block (HPB) technology, which is a copper-based heat sink that is in direct contact with the die, enabling a thermal resistance improvement of 16 percent.

Rohail Saleem Photo

About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur.

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