Samsung’s Heat Pass Block Technology Used On The Exynos 2600 For Better Heat Dissipation & Increased Sustained Clocks To Be Adopted By Other Android SoC Makers

How We Rate Rumors

• 0-20%: Unlikely - Lacks credible sources
• 21-40%: Questionable - Some concerns remain
• 41-60%: Plausible - Reasonable evidence
• 61-80%: Probable - Strong evidence
• 81-100%: Highly Likely - Multiple reliable sources

RUMOR ASSESSMENT

60%

Plausible

Source 3/5

Corroboration 1/5

Technical 4/5

Timeline 4/5

The Exynos 2600 was Samsung’s first chipset to not just adopt Fan-out Wafer Level Packaging (FOWLP), but also incorporate its Heat Pass Block (HPB) technology, which acts as a heatsink and enables a thermal resistance improvement of 16 percent. In short, the chipset can dissipate heat better and reach higher clock speeds to increase its sustained performance. Now, the exact HPB implementation is arriving on other Android chipsets, and given the direction these chipsets are taking toward insane performance levels, this technology could become mandatory in future releases.

Qualcomm’s fourth-generation Oryon cores on the Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6 will likely target higher clock speeds, making Heat Pass Block a necessary component for the 2nm chipsets

The latest rumor posted by tipster Fixed-focus digital cameras cleverly mentions that ‘many chip manufacturers’ will utilize the Heat Pass Block technology without providing any actual names. Given Exynos’ overheating reputation, it is understandable why Samsung would resort to slapping a heatsink on top of the chipset die, but looking at the Snapdragon 8 Elite Gen 5 and Dimensity 9500, there is a strong reason for a Heat Pass Block to be added to their immediate successors.

For instance, in an in-depth Geekbench 6 analysis, we concluded that the Snapdragon 8 Elite Gen 5 was the fastest mobile chipset, but it required a 61 percent higher power draw to beat the A19 Pro. This level of wattage consumption means that top-end SoCs are generating immense heat to the point that even the most robust of vapor chambers cannot dissipate it effectively. Even the OnePlus 15, which, before the update, had its overheating problem addressed through a software update, was crashing benchmark applications because the temperatures were getting out of control.

It isn’t surprising that Qualcomm deliberately raised the Snapdragon 8 Elite Gen 5’s performance cores’ clock speed to 4.61GHz to compete with Apple, but as highlighted above, this move can have diminishing, or worse, deleterious returns if the thermals aren’t checked carefully. We expect that the Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6 will raise the bar further with the fourth-generation Oryon cores’ clock speeds, possibly reaching 4.80GHz, and even if TSMC’s 2nm ‘N2P’ helps with the efficiency bit, the power draw is expected to spiral out of control.

MediaTek is in the same boat because sticking with ARM’s CPU designs means they are less efficient than Qualcomm’s in-house Oryon cores, leading to excessive heat generation. We don’t expect the Taiwanese firm to switch its strategy with the Dimensity 9600’s release, but it is high time that these companies adopt Samsung’s Heat Pass Block as early as possible, because crystal clear evidence suggests that the smartphone companies’ vapor chambers aren’t doing the job. Also, assuming readers forgot, the aforementioned cooling technology has been mentioned to be adopted by other chipset makers due to its useful properties, so let us keep our fingers crossed.

News Source: Fixed-focus digital cameras

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