Now that Samsung has demonstrated its competence with the new Exynos 2600 chip, which has bested Qualcomm's Snapdragon 8 Elite Gen 5 chip in various benchmarks, especially the ones related to natural language understanding, object detection, and image classification, all the while maintaining an enviable thermal footprint, the South Korean behemoth is finally doubling down on its native silicon, with the sampling of the next-gen Exynos 2700 chip already underway.
Samsung is already fabricating production samples for its next-gen Exynos 2700 chip, following the completion of the design process in late 2025
According to a South Korean publication, Samsung has begun fabricating production samples for its next-gen Exynos 2700 mobile AP, and plans to complete this preliminary process by June 2026. Do note that previous reports have already indicated that the chipset is expected to enter mass production in the second half of this year.
The latest report notes that although the mass production of the Exynos 2700 chip is still somewhat distant, Samsung is moving swiftly on sample development to ensure thorough performance optimization and product maturity.
Kiwoom Securities analyst Park Yu-ak has already projected that "if foundry yields for the second-generation 2nm process used in the Exynos 2700 improve, it could achieve around 50% share within the Galaxy S27 series." Of course, if this projection pans out, Samsung would likely earn a windfall in cost savings via the reduced procurement of Qualcomm's next-gen flagship AP, dubbed the Snapdragon 8 Elite Gen 6 Pro.
For the benefit of those who might not be aware, Samsung's Exynos 2700 chip is expected to feature a relatively strange CPU core layout, consisting of:
- 4x ARM C2-lineup cores clocked at 2.88GHz
- 1x ARM C2-lineup core clocked at 2.78GHz
- 4x ARM C2-lineup cores clocked at 2.40GHz
- 1x ARM C2-lineup core clocked at 2.30GHz
The next-gen AP is also expected to come with the Xclipse 970 GPU, possibly based on a modified version of AMD's RDNA 5 architecture, LPDDR6 RAM, and UFS 5.0 storage. It could also incorporate a new heat dissipation solution called 'side by side' (Sb), which places the individual dies horizontally rather than stacked, concurrent with Samsung’s bespoke copper-based heat sink - called the Heat Path Block (HPB) - to further improve the chip's thermal performance. Head over to our dedicated hub page to gain extensive insights into Samsung's upcoming Exynos 2700 chip.
About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur.
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