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Hardware

AMD Ryzen 7 3700X and Ryzen 5 3600X CPU Review Ft. X570 AORUS PRO WIFI

Hassan Mujtaba

X570 AORUS Pro WiFi Motherboard - Unboxing

The X570 AORUS Pro WiFi comes in a large rectangular box with an easy carry handle on the top. The motherboard carries the iconic orange and black color scheme of the Gigabyte brand and the AORUS eagle branding on the front.

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The front side of the package features various marketing labels such as AMD Socket AM4, X570, Ryzen 3000 Desktop Ready, PCIe 4.0 Ready, RGB Fusion 2.0, 12+2 Phase Digital Power design, WiFi 6 Ready and the Gaming ViBes audio technology featured on the motherboard.

The back of the box contains all the marketing details along with product specifications. The most interesting features that are highlighted by AORUS include 12+2 phases IR digital VRM solution, a fully integrated advanced thermal design, a full PCIe 4.0 design, WiFi 6 and the ALC1220 powered audio system. There are other features such as RGB Fusion 2.0, Smart Fan 5, Fan Stop, Q-Flash +, Thermal Guard for M.2 slots, WIMA, and High-end audio capacitors, Intel GbE LAN and Dual armor design.

Within the package is a single container which houses the motherboard and the beneath is are the  accessories. The accessories for the X570 AORUS Pro WiFi include:

  • Quick Installation Guide, Support CD
  • 4 x SATA Data Cables
  • 1 x AORUS WiFi 2.4/5 GHz Antenna
  • 1 x AORUS Case Badge
  • 1 x LED Extension Cable
  • 1 x G-Connector
  • 2 x Screws for M.2 Sockets
  • 2 x Standoffs for M.2 Sockets

Outside of the package, the motherboard can be seen well placed in two foam containers that hold the motherboard nicely in place. The motherboard gives off the premium feel which is very nice for a PRO Tier AORUS motherboard and I can't wait to test it out with Ryzen 3000 series processors.

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Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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