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Hardware

AMD Ryzen 7 3700X and Ryzen 5 3600X CPU Review Ft. X570 AORUS PRO WIFI

Hassan Mujtaba

X570 AORUS Pro WiFi Motherboard - Features

AORUS sent me their latest AORUS motherboard based on the X570 chipset, the X570 AORUS PRO WiFi. Based on the pricing, the motherboard is a very high-end offering that retails for more than $250 US. You'd find almost all of the basic functionality for a motherboard along with a premium heatsink design that includes a huge fins stack over the VRMs and a solid board design that looks to offer some good aesthetics for most PC builders.

This high-end motherboard is priced at $269.99 US which is $30 US more than its predecessor, the X470 AORUS Gaming 7 WiFi.

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X570 AORUS Pro WiFi Motherboard Features:

  • Supports AMD 3rd Gen Ryzen/ 2nd Gen Ryzen/ 2nd Gen Ryzen with Radeon Vega Graphics/ Ryzen with Radeon Vega Graphics Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • 12+2 Phases IR Digital VRM Solution with PowIRstage
  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
  • Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Dual Thermal Guards
  • Intel WiFi 6 802.11ax 2T2R & BT 5
  • ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors
  • Intel Gigabit LAN with cFosSpeed Internet Accelerator Networking
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
  • Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Front & Rear USB 3.2 Gen2 Type-C Header & HDMI 2.0 support
  • Integrated I/O Shield Armor
  • Q-Flash Plus update BIOS Without Installing CPU, Memory and Graphics card

X570 AORUS Pro WiFi Motherboard Gallery:

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Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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