Google’s Tensor family of chipsets has always remained behind the competition, and with the Tensor G3, the expectations did not mount too much. However, in the latest Geekbench 6 leak, the upcoming Pixel 8 Pro performs better than anticipated, possibly thanks to Samsung’s more advanced node that improves thermals.
New Geekbench 6 leak also shows a 9-core CPU cluster of the Tensor G3, along with the 12GB RAM that will be a part of the Pixel 8 Pro
Yesterday, we got to report on a mini-unboxing of the Pixel 8, and today, Google’s top-end flagship, the Pixel 8 Pro, has been benchmarked on Geekbench 6, obtaining a single-core and multi-core score of 1,760 and 4,442, respectively. The results are higher than what we perceived about the Tensor G3, but history repeats itself once more as the SoC continues to be slower than the Snapdragon 8 Gen 2, which only means that the upcoming Snapdragon 8 Gen 3 will be running circles around it.
The Tensor G3 itself features a 9-core CPU cluster, which was mentioned in an earlier report too, so it is possible that the additional core aided in that multi-core improvement. The benchmark also notes that the Pixel 8 Pro tested sports 12GB RAM, and in case you did not know, the memory count remains unchanged from last year’s Pixel 7 Pro. The device was also tested with Android 14 and will likely be one of the first models to get updated to the latest version.
If you are disappointed with the Tensor G3’s single-core and multi-core results, know that next year’s Pixel release will not have significantly improved performance figures either. Google is said to stick with Samsung’s foundry for the Tensor G4 in 2024, with the Pixel 9 and Pixel 9 Pro offering a minor upgrade over the upcoming models. We should see the company finally competing with the big guns in 2025 when it is rumored to finally switch to TSMC, and mass produce the Tensor G5, which is said to arrive with its custom cores instead of ARM’s designs.
News Source: Geekbench 6
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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