G.Skill Unleashes Up To 256 GB Quad Channel DDR4 Memory Kits For AMD Threadripper & Intel Core-X HEDT Platforms
G.Skill has announced its latest high-performance, quad-channel, and ultra capacity DDR4 memory kits that are designed for AMD Ryzen Threadripper & Intel Core-X high-end desktop platforms. G.Skill caters to the high-end desktop community with up to 256 memory kits designed specifically for the latest HEDT TRX40 and X299 motherboards.
G.Skill Unveils Their Ultra-Capacity, Quad-Channel DDR4 Memory Kits With Up To 256 GB Capacities
Today saw the launch of AMD's 3rd Gen Ryzen Threadripper and Intel's 10th Gen Core-X series processors which we covered in their own respective reviews. For those who are building newer PCs centered around the latest HEDT processors, G.Skill is now offering a whole range of quad-channel memory kits to select from.
The memory kits come in two flavors. The high capacity variants include DDR4-3600 (CL16-19-19-39) and DDR4-4000 (CL18-22-22-42) configured 256 GB memory kits. The kits include 8 DIMMs that are based on the dual-capacity design, offering 32 GB capacity per DIMM for a total of 256 GB. The second flavor is the high-speed and ultra-low-latency kit which comes in DDR4-4000 (CL15-16-16-36) configuration. This kit features 64 GB capacity (8GB x 8 DIMMs). You can find more details in the press release below:
G.SKILL, the world’s leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms, including the high-capacity DDR4-3600 CL16-19-19-39 256GB (32GBx8), DDR4-4000 CL18-22-22-42 256GB (32GBx8), and the high-speed, low-latency DDR4-4000 CL15-16-16-36 64GB (8GBx8) specifications. By bringing ultra-high 32GB memory module capacity into the realm of HEDT computing, powerful workstations are now truly able to achieve a complete combination of high core count processor with high-speed, high-capacity memory for heavy workloads or for running more virtual machines than ever.
Full Power of the Intel X299 Platform
Built for the ultimate memory performance, the G.SKILL is releasing the DDR4-4000 CL15-16-16-36 64GB (8GBx8) memory specification that combines both extremely high speed and ultra-low latency in a high capacity 64GB memory kit. As seen validated on the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE and MSI Creator X299 motherboards in the screenshots below, this supremely fast memory kit is the ideal choice for high-performance workstations:
For ultra-high capacity memory kits, built with the latest high-density 32GB modules, the DDR4-4000 CL18-22-22-42 256GB (32GBx8) is the perfect choice for memory-hungry applications, like running multiple virtual machines. In the screenshot below, this behemoth memory kit is seen validated with Intel Core i9-9920X and i9-9820X processors with the MSI Creator X299 and ASUS PRIME X299-DELUXE II motherboards, respectively.
Pushing the Limits of the AMD TRX40 Platform
Built for use with the latest 3rd Gen AMD Ryzen Threadripper processors and optimized for squeezing out every last ounce of performance, G.SKILL has integrated low latency specifications of DDR4-3600 CL14-15-15-35 into a 64GB (8GBx8) Trident Z Neo memory kit. In the following screenshot, this highly efficient memory kit is validated with the latest AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard.
G.SKILL is also launching an ultra-high capacity memory kit based on high-density 32GB memory modules for the AMD platform, with the DDR4-3600 CL16-19-19-39 256GB (32GBx8) specification. This extreme capacity memory kit is also validated with the AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard in the screenshot below.
Availability & XMP 2.0 Support
These high-performance quad-channel memory specifications will support Intel XMP 2.0 for easy overclocking and will be available via G.SKILL worldwide distribution partners in late Q4 2019. Please see the specifications table below for a more complete list of the upcoming quad-channel memory kits.