DDR6 RAM commercialization is expected between 2028 and 2029, but CXMT and its supply chain are already making advancements to ensure that they’re on top of this opportunity before Samsung and SK hynix have a chance to execute their grip in global markets. To ensure that the transition from DDR5 to DDR6 remains smooth and efficient, the Chinese memory maker has brought in a new manufacturer that’s considering the introduction of a panel-based process over the existing method for DDR4 and DDR5 manufacturing.
DDR6 RAM will sport a multi-layer design, requiring a manufacturing overhaul that doesn’t negatively impact CXMT’s yields
For DDR4 and DDR5 production, CXMT doesn’t need to resort to complicated manufacturing procedures, as both standards require single or low-layer substrates without compromising yields. Despite the firm’s DDR5 memory trailing behind SK hynix’s variants at identical speeds, the company is eager to move toward DDR6 production.
To help with this transition, ETNews reports that Haesung DS, the latest entrant into CXMT’s supply chain and a leading manufacturer of package substrates, had reportedly passed its customer’s latest quality qualification tests for DDR5 package substrates in the first quarter of 2026. DDR4 and DDR5 production was made possible using an inexpensive method called Reel-to-Reel.
With DDR6 RAM, Haesung DS is moving forward with a new panel method that promises multi-layer designs for next-generation memory, helping to maintain production efficiency without running into roadblocks. Theoretically, the existing Reel-to-Reel method can also be used for DDR6 manufacturing, but profitability and efficiency witness a decline as the number of circuit layers increases, making the panel approach a safer bet.
With Samsung and SK hynix already developing DDR6 RAM, CXMT is racing against the clock, but its name is already echoing through the supply chain chambers thanks to the ongoing DRAM shortage. With companies unable to secure adequate shipments, CXMT’s existence comes as a sigh of relief, not because of its technological chops, but because its unique position is able to reduce supply risk for several clients.
Apple, which is reportedly exploring a partnership with the Chinese manufacturer, is already said to be testing its memory chips, which should be sufficient motivation for CXMT to accelerate DDR6 development. The report doesn’t explicitly mention when the Chinese-made DRAM will enter mass production, but we’ll keep our fingers crossed.
News Source: ETNews
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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