TSMC’s 1.4nm Process, Also Called Angstrom, Will Make Even The Most Lucrative Clients Think Twice When Placing Orders, With An Estimate Claiming That Each Wafer Will Cost $45,000

Omar Sohail
TSMC building
TSMC building | Image Credits: TSMC

Established names in the technology industry, such as Apple, MediaTek, Qualcomm, and others, are already gunning for TSMC’s 2nm process, with the latter said to have started accepting orders from April 1. At $30,000 per wafer, the next-generation node was already going to be a tough pill to swallow, but these companies would have little problems spending billions to obtain an edge against one another, or to keep pace. Unfortunately, it gets only harder from here, because a recent estimate claims that after the 2nm process, 1.4nm ‘Angstrom’ will serve as the immediate successor, but its cost may reach $45,000.

At the aforementioned cost, TSMC’s 1.4nm Angstrom will be 50 percent more expensive than the 2nm node

A report from China Times states that only TSMC’s top customers can even entertain the thought of placing orders for 1.4nm wafers, as the cost may reach $45,000 per wafer. Compared to the 2nm node, that is a 50 percent price delta, but it is equally important to remember that it will be a few years before the Taiwanese semiconductor behemoth will commence production, with the earliest timeline provided being 2028. Currently, there are no clients who have reportedly shown interest in the technology, suggesting that their primary focus is on 2nm.

Related Story AI Chip Frenzy Drags Foundry Revenue Up 3.7% in Q1, Yet Wafer Prices Are About to Hit Customers Next

MediaTek, which has been one of TSMC’s top customers for a few years, had previously announced that it would begin tape-out of its 2nm chipsets in the fourth quarter of 2025, signaling to its competitors that they should be equally prepared or risk being an entire generation behind. If there is any company that would want a first crack at the Angstrom process, it would be Apple. The Cupertino firm has been criticized for adopting several technology standards much later than its rivals, but when it comes to leveraging TSMC’s cutting-edge wafers, Apple has shown to be a leader in this space.

Later this year, we should witness the arrival of various chipsets mass produced on TSMC’s third-generation 3nm process, also called ‘N3E,’ with MediaTek’s Dimensity 9500, Qualcomm’s Snapdragon 8 Elite Gen 2, and Apple’s A19 and A19 Pro all said to be fabricated on this process.

News Source: China Times

Omar Sohail Photo

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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