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iPhone 15 Pro, iPhone 15 Pro Max Could Be Configured With 2TB Of Internal Storage, But With An Obvious Price Hike
Xbox Series X Digital Model Is Being Looked Into by Microsoft; Other Hardware Is Planned for 2025 – Rumor
Apple M3, M3 Pro, M3 Max CPU & GPU Configurations Shared; Up To 40 Cores Will Be Supported
Pixel Watch 2 To Get Major Specifications Uplift Over Previous Model; Support For UWB, More Efficient SoC, Bigger Battery In Tow
AMD Ryzen 8000 “Strix Point” APUs Feature 4 Zen 5, 8 Zen 5C CPU Cores, 16 RDNA 3.5 GPU Cores & 16 MB Cache
Nintendo Switch 2 Backward Compatibility Is Seemingly Still up in the Air
Quake II Remaster to Be Unveiled at QuakeCon, Says Leaker
Qualcomm Still Not Decided On Snapdragon 8cx Gen 4 Launch Timeline, May Arrive After Apple’s M3
Intel Meteor Lake Core Ultra 9 CPUs Break Past 5 GHz Clocks & Core Ultra 7 Around 5 GHz
AirTag 2 Launch To Happen In 2025 Instead Of Next Year, Claims Sketchy Rumor, Will Support ‘3D Precision Finding’
AMD RDNA 4 “Navi 4X” Lineup Rumored To Not Include Any High-End GPUs
Galaxy S24 Ultra To See 3x, 10x Zoom Camera Quality Improvements, Though It Might Re-Use The Same Sensors As The Galaxy S23 Ultra
Nintendo Switch 2 to Feature as Much as 512 GB of Internal Storage, 8-Inch LCD Screen – Rumor
PlayStation 5 Pro SoC Likely to Use N4P, 4nm Process Node – Rumor
Nintendo Switch Successor May Be Unveiled This Month – Rumor
Snapdragon 8 Gen 3 Rumored To Have A ‘Special Version’ That Supports Satellite Communications
Apple May Be Able To Develop Powerful M2 Extreme Successors With Higher CPU, GPU Cores Thanks To TSMC’s 3DFabric Technology
The Galaxy S23 FE Camera Leak Shows How The Company Wants To Do Right By The Users
Samsung Finally Listening To Its Customers; Rumored To Bring LTPO Displays To Galaxy S24 & Galaxy S24 Plus
Intel Lunar Lake CPUs Feature 64 Xe “Battlemage” EUs For iGPU, 8 Xe-Cores & Next-Gen VPU
STALKER 2 Is Reportedly Playable at Gamescom 2023
Snapdragon 8 Gen 4 CPU Configuration Detailed, To Feature Custom ‘Phoenix’ Cores And Mass Produced On TSMC’s N3E Process
Xiaomi 14 Pro To Be The World’s First Android Smartphone To Switch To A Titanium Build
Galaxy S24, Galaxy S24 Plus To Feature The Same Slim Bezel Displays As The Upcoming iPhone 15 Pro Models, Claims Tipster
Apple To Adopt TSMC’s 3DFabric Technology For High-Performance Computing, Company Plans To Use It In Future MacBook Models
Exynos 2400 Will Be Arriving In Two Major Smartphone Markets, Claims Tipster Who Is ‘100%’ Sure
Apple Is Exploring The Use Of ‘LIPO’ Technology To Substantially Reduce Bezels On Its Premium iPhones And iPads
AMD Ryzen 8000 Strix Point APUs Utilize 12-Core Zen 5 & Zen 5C Hybrid Config, Strix Halo With 16-Core Chiplet Design
Pokémon Presents Expected To Drop by August 8, Reveals New Datamine
Galaxy S24 Ultra To Switch To Titanium Next Year Just Like The iPhone 15 ‘Pro’ Models, According To Tipster’s Latest Teaser
TSMC Continues To Receive ‘Smartphone’ Orders For Its N3E Chips, But No Mention Of Which Clients Are Pursuing This Manufacturing Process
Galaxy Z Fold 6 And Galaxy Z Flip 6 Could End Up Bringing Dust Resistance And Samsung Confirms Its Working On Making it Possible
Red Dead Redemption Remaster May Be Coming to Nintendo Switch – Rumor
PlayStation 5 New Model to Sport 5nm APU, No Liquid Metal Cooling – Rumor
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