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All posts related to the industry in general.
TSMC Doubles Down on 2nm With Five Fabs Ramping at Once, Output Set to Eclipse 3nm by 2x
Intel, AMD & MediaTek Are Boosting CPU Production But Prices Continue To Increase & Lead Times Reach 1-Year Mark
Intel Xeon 6 With AMX Accelerate Microsoft’s Azure Local, Scaling Deployments To 1000s of Servers
China’s LineShine Supercomputer To Hit 2 ExaFlops With 47,000 CPUs and Zero Reliance on Foreign Chips
Samsung 18-Day Strike Could Cut-Off DRAM & NAND Output By Up To 4%, & Recovery Will Take 2-3 Weeks
Intel Is Now Selling CPU Dies It Used to Throw in the Trash, as AI Demand Turns Scrap Into Profits
NVIDIA Taps Taiwanese Nanya Technology’s LPDDR5X Memory For Vera Rubin Platform, Offering 3x Capacity & Over 50% Bandwidth Boost
TSMC’s Key CoWoS Packaging Supplier Drags Ex-General Manager to Court While Denying Any Tech Reached China
Intel’s Revolutionary ZAM Memory, A Low-Power & High Density HBM Replacement, Receives Big Boost From Japan
TSMC Maps Out A13 “1.3nm” & A12 “1.2nm” Nodes For 2029, Sidesteps ASML’s Priciest EUV Tools For Now
Intel 14A Wins Over Elon Musk As The “State of The Art” Process Tech To Be Deployed at TeraFab
OpenAI Patent Reveals Custom AI Chip With 20 HBM Stacks, Using Intel EMIB-Style Bridges to Smash Current Limits
GDDR6 Memory Demand Surge Could Be Bad News For Sony’s PlayStation 5 & Gaming GPUs
SK Hynix Answers the HBM Shortage With a 32-Soccer-Field Mega-Fab, P&T7 Dedicated To HBM Production, Ready By 2028
Samsung Postpones HBM5E Memory Production Indefinitely After D1d DRAM Yields Fall Short of Internal Targets
130,000 Rubin GPUs Are Being Deployed at Nscale For Microsoft, Further Showing Massive Interest In NVIDIA’s Next-Gen AI Chips
TSMC Is Pouring $56 Billion Into New Fabs, Yet CEO Wei Admits Shortages Will Drag Into 2027 and Beyond
China’s Premiere Memory Maker Hits HBM3 Roadblock As Domestic DRAM Makers Rush HBM Manufacturing
Qualcomm CEO Flies to Korea, Hunting 2nm Wafers at Samsung and LPDDR Supply at SK Hynix
AMD Taps GlobalFoundries for MI500’s Co-Packaged Optics as the Silicon Photonics Race With NVIDIA Heats Up
Google Splits TPUv8 Strategy Into Two Chips, Handing Broadcom Training and MediaTek Inference Duties
Google Reportedly Pulls Marvell Into a Two-Chip TPU Plan That Could Reshape AI Inference For ASICs
Memory Makers Will Only Meet 60% of DRAM Demand Through 2027, Locking In Years of Shortages and Price Pain
Microsoft’s Fairwater AI Datacenter Goes Live Early, Unleashing Hundreds of Thousands of NVIDIA Blackwell GPUs On The World
Intel Expected To Land Big 14A Wins With Surprise Customers By The End of This Year
ASML Sees Memory Chip Orders Explode Past Logic for the First Time as DRAM Makers Scramble for EUV Slots
Elon Musk Tells TSMC’s CEO That Terafab Wouldn’t Exist if the Foundry Could Keep Up With His Chip Demand
China’s YMTC & CXMT Are Doubling Wafer Output in an ‘Epic Expansion,’ Yet Buyers Are Scrambling to Prepay for Memory Supply
UMC Joins a Global Wave of Chipmakers Hiking Wafer Prices, Leaving Clients with Few Places Left to Turn
Samsung Slashes Its HBM Development Cycle from 2 Years to 1, Betting Its Future on AI Demand
AMD’s Instinct MI450 Reportedly Secures A Major AI Customer
Intel Foundry Lands a Samsung Veteran With 30 Years of Chip Experience, Betting He Can Fill Its Customer Gap
TSMC’s CEO Calls Intel a Formidable Competitor but Says No Shortcuts Exist in the Foundry Game
NVIDIA Wants Everyone To Rethink AI TCO, & Explains Why “Cost Per Token” Is The Only Metric That Matters
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