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New Snapdragon 1000 Details Emerge – 12W TDP, 16GB RAM Support and Much Bigger Dimensions Than Other ARM Chips

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Jun 23, 2018
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Qualcomm’s extended push to bring more powerful ‘Always Connected PCs’ introduced the 10nm FinFET Snapdragon 850, but we earlier reported about the Snapdragon 1000 featuring more TDP in order to deliver greater performance than the other SoCs. Now, more details about the upcoming chipset have emerged, detailed that it is going to share properties that are quite different than the ones we’re used to seeing on chips running in smartphones and tablets.

Snapdragon 1000 Reportedly Featuring a 20 x 15mm Package Size – Smaller Than Intel but Much Larger Than ARM Counterparts

According to information published by WinFuture, the upcoming Snapdragon 1000 will have a die size that is bigger than what we are used to seeing on chips fueling smartphones and tablets. The package size is reportedly 20 x 15mm, while an Intel processor belonging to the company’s ‘U’ series features a package size of 45 x 24mm. The Snapdragon 1000 is nowhere close to being as big as Intel’s chips, but the latest development reveals that the U.S.-based chip manufacturer is coming close.

snapdragon-notebooks-4Related Snapdragon 1000 Details Leaked From Job Description Reveals a Premium SoC Meant for ‘Desktop’ Computers Apparently

Another thing to note is that the developer platform where the Snapdragon 1000 is being tested out provides support for up to 16GB LPDDR4X memory, and two 128GB UFS 2.1 memory modules, equaling 256GB of internal storage. The device is also providing support for Gigabit WLAN, meaning that a very capable machine is in the works.

Now here is something very interesting to note; the Snapdragon 1000 is reportedly not completely soldered on the mainboard but features its very own special socket like Intel and AMD motherboards are made for desktop systems. Keep in mind that this is only for the developer platform and that the devices shipped out to consumers might be completely soldered. This could be done because of the increased surface area of the chip, but things can change drastically when a final product is being readied.

The current Snapdragon 850 has a maximum TDP of 6.5 watts, while the Snapdragon 1000 is nearly competing with the Intel ‘U’ series of processors with its 12-watt TDP. We also reported that ASUS is said to be working on a device codenamed Primus and it is going to be fueled by the Snapdragon 1000.

You should be reminded that this information is by no means complete and since it is based on developer platform information, there may be some changes to the introduction of finished devices and processors to stay tuned for the latest.

Source: WinFuture

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