Smartphone DRAM and memory manufacturers are researching ways to launch faster and more efficient chips to excel in the use of on-device AI applications and offset the performance throttling issues encountered by current technology. SK hynix, which has surpassed Samsung in the technological aspect of memory manufacturing, has said that it has begun supplying a newer form of mobile DRAM that adopts an industry-first ‘Molding Compound’ that is designed to tackle overheating in smartphones. The company claims the latest memory chips’ thermal conductivity has improved by 350 percent.
The new material used on SK hynix’s mobile DRAM is called ‘High-K Epoxy Molding Compound’
With the improvements highlighted by SK hynix on its latest mobile DRAM, the company says that the thermal resistance in the heat’s vertical source has improved by 47 percent. On some logic boards, the mobile DRAM is stacked on top of the chipset die, and during intense workloads, the excess heat can cause performance degradation. The majority of smartphone makers opt for this design because it frees up space and improves data transfer between the DRAM and the chipset, as there is less distance for that data to travel.
With the new material, SK hynix says that smartphones equipped with these memory chips are expected to deliver better battery life while improving performance. The company’s head of Package Product Development, Lee Gyu-jei calls the use of High-K Epoxy Molding Compound a ‘meaningful achievement’ and states that this approach will address many of the problems that flagship smartphone users faced.
“It’s a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had. We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials.”
According to The Korea Herald, SK hynix says that it found a solution to improve thermal conductivity by adding Alumina to Silica. By adding the newer compound to the Epoxy Molding Compound, it was able to achieve better heat transfer. There is no specific timeline for when we will see these mobile DRAM chips in action, but we will not be surprised if 2026 flagship smartphones are found to be using this technology.
News Source: SK hynix
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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