During its Q2 2025 earnings call, Samsung announced that it would ‘ramp up mass production of a new mobile SoC with the 2nm GAA process’ in the second half of 2025, and while it was obvious which silicon the company was referring to, the announcement was mum about the details. Fortunately, during a Q&A session, an analyst revealed that the first chipset to be fabricated on the Korean giant’s next-generation lithography will be the Exynos 2600, bringing some competition to the flagship smartphone segment. As for performance, we only know that it will deliver better NPU capabilities over the previous silicon.
No word on the Exynos 2600’s compute or GPU performance hints that Samsung is still trying to optimize its first 2nm GAA chipset before divulging any key details
The prototype mass production phase of the Exynos 2600 reportedly kicked off in June, and around that time, industry estimations mentioned that Samsung’s 2nm GAA yields were approximately 30 percent. These figures are not even close to a threshold that would make mass production commercially viable, but Samsung’s progress is miles better compared to the problems it faced with its 3nm GAA technology. Furthermore, the Korean technology behemoth has apparently made it its goal to reach 70 percent yields by the end of the year, which is a number that could potentially land orders from prominent industry players like Qualcomm.
Samsung has already secured a lucrative $16.5 billion deal with Tesla to mass manufacture chips on the aforementioned lithography, meaning that the company has the correct objective in mind. On X, during a Q&A session, analyst Bryan Ma confirmed that the Exynos 2600 would be Samsung’s first 2nm GAA chipset, but interestingly, the firm did not mention the kind of compute or GPU performance to expect. Instead, the company stated that the SoC will deliver NPU performance that significantly outpaces what the previous-generation version could achieve, which we assume would be the Exynos 2500.
Since the Exynos 2600 has already been spotted on Geekbench 6 sporting a 10-core CPU cluster, it is sufficient evidence that Samsung is rigorously testing the chipset and preparing it for a future launch. As for why the company did not reveal its raw performance compared to the competition, it is possible that the Exynos 2600 is still being optimized, with Samsung reportedly implementing ‘Heat Pass Block’ technology, or HPB, to help with better heat dissipation, along with incorporating FOWLP, or ‘Fan-out Wafer Level Packaging,’ to improve heat resistance and deliver increased multi-core performance. For Samsung’s sake, it needs to get everything right, or this will be yet another missed opportunity.
News Source: Bryan Ma
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
Follow Wccftech on Google to get more of our news coverage in your feeds.
