Samsung To Reportedly Implement ‘Heat Pass Block’ Technology To The Upcoming Exynos 2600 To Help With Better Thermal Transfer, Avoid Overheating And Introduce Better Efficiency

Omar Sohail
Exynos 2600 could avoid overheating thanks to Samsung's latest implementation
With Samsung's latest technology, overheating might be a thing of the past with the Exynos 2600

The Exynos 2600 is currently in the prototype production stage, with Samsung utilizing its 2nm GAA process to introduce a new step in performance and efficiency for its upcoming flagship SoC. Unfortunately, given how past releases have more or less suffered from incessant overheating even with the use of vapor chambers in smartphones, a report states that the Korean manufacturer will implement a technology called ‘Heat Pass Block’ or HPB, to improve heat dissipation, allowing the Exynos 2600 to perform optimally.

HPB will essentially function as a heatsink for the Exynos 2600 to improve thermals, leading the SoC to run at its maximum clock speeds for longer periods

The existing chipset structure for Samsung’s Exynos range involved the DRAM placed directly on top of the SoC. Now, ETNews reports that both the HPB and the DRAM will sit directly on the Exynos 2600, with the new addition acting as a heatsink to facilitate better heat transfer. On top of the Heat Pass Block, Samsung is reported to implement its FOWLP, or ‘Fan-out Wafer Level Packaging,’ to improve heat resistance and deliver increased multi-core performance.

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This packaging debuted in the Exynos 2400, and Samsung reportedly wants to bring it to the Exynos 2600 to ensure that it maintains some pace with the upcoming Snapdragon 8 Elite Gen 2 and the Dimensity 9500. A recent Geekbench 6 leak revealed that the Exynos 2600’s highest clocked core operated at 3.55GHz, making it slower than the Cortex-X925 running in the Dimensity 9400+.

The presence of the HPB and FOWLP should allow the Exynos 2600 to reach higher frequencies, leading to better single-core and multi-core performance while maintaining its temperatures. We can all agree that increased temperature leads to performance degradation, which not only makes the device uncomfortable to hold, but it also can strain the battery and run the risk of it exploding, making it a ticking time bomb.

Assuming that Samsung’s 2nm GAA process can reach favorable yields, the Exynos 2600 could be unveiled by the end of this year and just in time before the company’s Galaxy S26 family is announced in early 2026.

News Source: ETNews

Omar Sohail Photo

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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