Samsung LSI Plots Exynos 2700 Counterattack With Just 60% Yields As Qualcomm Floods Galaxy S27 With Six Snapdragon 8 Elite Gen 6 Pro Variants

Rohail Saleem
Samsung says it's working on the Exynos 2700
Aside from upgraded NPU performance, Samsung has provided little details, but it should still be an exciting launch

Qualcomm appears determined to squeeze out Exynos 2700 from the upcoming Galaxy S27 series, and has prepared as many as six Snapdragon 8 Elite Gen 6 Pro variants to render Samsung Mobile spoilt for choice. Samsung LSI, however, is now reportedly equally adamant at not letting Qualcomm eat its lunch and is preparing an apt "response" to this gambit.

Samsung's Galaxy S27 series is emerging as an unequivocal winner in the ongoing tussle between Qualcomm's Snapdragon 8 Elite Gen 6 Pro variants and Samsung LSI's Exynos 2700 chip

As we reported recently, Qualcomm is preparing as many as six variants of its Snapdragon 8 Elite Gen 6 Pro chip for Samsung's Galaxy S27 series, offering various configurations, including a choice between LPDDR6 and LPDDR5X RAM, and, possibly, binned cores and/or varying clock speeds.

Related Story Exynos 2700 Development “Proceeding Without Setbacks” But Samsung’s Struggling Chipset Business Is Burdening The Division

Qualcomm's aggressive move for a greater share of the Galaxy S27 series pie is not sitting well with Samsung Systems LSI, which is reportedly now preparing an apt "response," one that might entail a greater number of Exynos 2700 chip variants, as per an X post by the tipster Schrödinger.

For the benefit of those who might not be aware, the Exynos 2700 chip is expected to leverage Samsung's SF2P process, which is its second-gen 2nm GAA node. It is also likely to stick with ARM's C2-class CPU cores and an Xclipse-class GPU, which is based on AMD's RDNA 4 architecture.

The Exynos 2700 is also expected to sport a new thermal solution, called Side-by-Side (SbS), where individual dies for the AP and the DRAM are stacked horizontally, and a copper-based heat sink, called Heat Path Block or HPB, is placed on top.

Of course, given the latest tidbit, we are now likely to see a number of Exynos 2700 variants, sporting either the LPDDR6 or the LPDDR5X RAM, as well as various configurations of binned cores and/or clock speeds.

One limiting factor, however, is Samsung's still-constrained yields on its SF2P process, which currently sit at just 60 percent, giving Qualcomm a critical inroad.

Rohail Saleem Photo

About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur.

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