60%
Plausible
The Exynos 2600 was just a sneak preview of what’s to come from Samsung’s side as far as future smartphone chipsets are concerned. According to the latest leak, the Korean giant is adamant to reduce its dependency on Qualcomm by carving out its own path. The company is said to be planning three SoC releases, with each generation more advanced and feature-rich than the last.
Codenames of the three next-generation Exynos chipsets revealed, indicating Samsung wants to branch out from Qualcomm’s shadow
The Exynos 2700 is already planned to be announced in Q4 2026 or Q1 2027, but the exciting part about this rumor is that we’ll eventually be graced by three generations of launches, assuming Samsung’s foundry division doesn’t suffer from incessant setbacks. The list shown below highlights the chipsets’ names and their respective codenames.
- Exynos 2700 - Ulysses
- Exynos 2800 - Vanguard
- Exynos 2900 - Whistler
We’ve reported on multiple occasions that the Exynos 2700 is Samsung’s next-generation 2nm SoC and will leverage the company’s SF2P node for better performance and efficiency compared to the Exynos 2600. Fortunately, hearing that we’ll get two more releases after the upcoming one suggests Samsung has enough confidence in its advanced lithography to reduce its reliance on Qualcomm.
As for the Exynos 2800, we’ve reported that the latter will be Samsung’s first SoC to ship with an in-house GPU, hinting that Samsung’s collaboration with AMD will come to an end. What’s more important is that the silicon is being tailored to be used in applications beyond smartphones, which is an excellent step to boost its semiconductor ecosystem and market share.
However, the Exynos 2800 will stick with Samsung’s 2nm GAA node, albeit with the more improved SF2P+, as it reportedly prefers stabilized yields rather than competing with rivals over next-generation manufacturing processes. Fortunately, that’s where the Exynos 2900 comes in, and we believe that its launch and Samsung’s commercialization of the 1.4nm node won’t be mere coincidence.
With the foundry giant aiming for mass production in 2029, the Exynos 2900 could be the first recipient of this next-generation technology. Also, if you thought that Samsung is only laser-focused on fabricating its SoCs on the next-generation lithography, we’ve discussed a surprise below that could give the company a massive edge over the competition.
Samsung’s efforts in advanced packaging are giving the Exynos lineup a new lease on life
The Exynos 2600 was the product of a new packaging designed by Samsung, where the LPDDR5X RAM chip was shrunk in size without compromising performance, with a copper heatsink called Heat Pass Block (HPB) placed on top of the SoC die to improve heat dissipation. The Exynos 2700 will take a step beyond this implementation, shying away from on-package memory, keeping the DRAM separate to improve thermals.
The Exynos range has garnered a reputation for running exceptionally hot, and Samsung, recognizing this disadvantage, not only developed a path to improve them using its advanced manufacturing processes but also introduced newer packaging that further improves cooling. Now all that’s left to see is if the three aforementioned SoCs arrive on schedule.
News Source: Gamma’s hardware information
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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