iPhone 7 Plus 3D Drawings Clears Our Doubt Of What To Expect From The Phablet

Omar Sohail
iPhone 7 Plus 3D Drawings Clears Our Doubt Of What To Expect From The Phablet

Looking at the several 3D renderings of Apple’s iPhone 7 Plus, we have to say that things are finally starting to make sense, even though it does not necessarily mean that the consumer will be happy to hear about this, so let us begin.

3D Drawings Of iPhone 7 Plus Show That There Are Going To Be Three Models Introduced – Pro Model To Be Launched Later

There are several images that you can see from the 3D drawings, with several of them showing that Apple’s iPhone 7 Plus is not going to feature a 3.5mm headphone jack, thus confirming the long rumor that the company is dead serious about getting rid of this port. However, the source also states that the company is also going to incorporate a Type-C USB port, which only seems logical. With the company’s 12-inch MacBook sporting this port, not to mention that Apple’s 2016 MacBook Pro lineup will also having their fair share of Type-C USB ports, such a change was bound to happen.

Unfortunately, the absence of a 3.5mm headphone jack means that you will not be able to listen to media and charge your device at the same time, which is probably the reason why Apple also intends on placing a wireless charging circuit inside its iPhone 7 Plus.


From our plethora of previous reports, details of the upcoming smartphone include 3,100mAh battery upgrade, which is huge even by Apple standards, along with on-board storage increased to 256GB.


The iPhone 7 family could also have a ‘bezel-less’ display, and both this and the upcoming 5.5-inch phablet are expected to be even more appealing than their previous generation counterparts. Moreover, the upcoming products are expected to be incorporated with EMI shielding technology, which is one of the contributors why your phone dies on you at a quicker pace.

iPhone (1)

Apart from this, Both TSMC and Samsung have developed a new chip making technology called FoWLP. For those that don’t know, FoWLP stands for Fan-Out Wafer Level Packaging and it allows manufacturers to further reduce the thickness of its smartphones without relying on other methods to do so (such as removing the 3.5mm headphone jack altogether). This is because this particular tech does not require a PCB to place the primary components on and what’s more is that it contributes heavily to efficiency as well. In fact, it’s been reported that the components will consume up to 30 percent less energy through FoWLP.

iPhone (10)

Look at the 3D drawings and tell us what sort of changes can you identify? We’ll be hearing to see what your keen eye can spot.


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