Intel’s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot Unveils MCM Design & Up To 80 Cores In 4 Chiplets

Hassan Mujtaba
Intel's Next-Gen Xeon Sapphire Rapids Xeon CPU Die Shot Unveils MCM Design & Up To 80 Cores In 4 Chiplets

New die shots of Intel's next-gen Sapphire Rapids Xeon CPUs have surfaced which show an MCM design that could house up to 80 cores. The leak comes from Bilibili and shows us an engineering sample of the upcoming chip.

Intel Sapphire Rapids Xeon CPU Die Shots Unveils MCM Design With 4 Chiplets

We did get a close-up look at Intel's 4th Gen Sapphire Rapids Xeon CPU dies last month but we didn't get to see what's underneath those dies. The leaker managed to expose each of the four chiplet dies on the main interposer. With all four chiplets exposed, we can see that underneath them is a 5x4 core configuration which means each die consists of up to 80 cores. However, the entire 80 core silicon will never be released to the public due to the mesh layout.

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Theoretically, Intel's Sapphire Rapids-SP Xeon CPUs could feature a maximum of 72 cores and 144 threads but we know from previous leaks that the maximum configuration is going to end up at 56 cores and 112 threads. In the previous leak, the leaker stated that we were looking at an ES chip that featured a total of 60 cores (15 cores per die or a 5x3 layout) while the actual chip only had 56 cores (14 cores per die) enabled.

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The CPU will additionally come in HBM configurations with up to 64 GB capacities (4 x 16 GB stacks) and will also feature DDR5 and PCIe 5.0 I/O onboard. Another interesting thing is that the LGA4677 chips will feature a gold-plated IHS and feature a soldered design with liquid-metal TIM. The IHS on the Sapphire Rapids chips is also brand new but the chip itself comes in the same rectangle shape that we have seen on previous Xeon offerings.

Here's Everything We Know About Intel's 4th Gen Sapphire Rapids Xeon CPUs

The Sapphire Rapids-SP family will be replacing the Ice Lake-SP family and will go all on board with the 10nm Enhanced SuperFin process node that will be making its formal debut later this year in the Alder Lake consumer family. From what we know so far, Intel's Sapphire Rapids-SP lineup is expected to utilize the Golden Cove architecture & will be based on the 10nm Enhanced SuperFin process node.

The Sapphire Rapids lineup will make use of 8 channel DDR5 memory with speeds of up to 4800 MHz and support PCIe Gen 5.0 on the Eagle Stream platform. The Eagle Stream platform will also introduce the LGA 4677 socket which will be replacing the LGA 4189 socket for Intel's upcoming Cedar Island & Whitley platform which would house Cooper Lake-SP and Ice Lake-SP processors, respectively. The Intel Sapphire Rapids-SP Xeon CPUs will also come with CXL 1.1 interconnect that will mark a huge milestone for the blue team in the server segment.

Intel Sapphire Rapids-SP Xeon Server CPU Specifications. (Image Credits: Videocardz)

Coming to the configurations, the top part is started to feature 56 cores with a TDP of 350W. What is interesting about this configuration is that it is listed as a low-bin split variant which means that it will be using a tile or MCM design. The Sapphire Rapids-SP Xeon CPU will be composed of a 4-tile layout with each tile featuring 14 cores each.

It looks like AMD will still hold the upper hand in the number of cores & threads offered per CPU with their Genoa chips pushing for up to 96 cores whereas Intel Xeon chips would max out at 56 cores if they don't plan on making SKUs with a higher number of tiles. Intel will have a wider and more expandable platform that can support up to 8 CPUs at once so unless Genoa offers more than 2P (dual-socket) configurations, Intel will have the lead in the most number of cores per rack with an 8S rack packing up to 448 cores and 896 threads.

The Intel Saphhire Rapids CPUs will contain 4 HBM2 stacks with a maximum memory of 64 GB (16GB each). The total bandwidth from these stacks will be 1 TB/s. According to leaked details from AdoredTV, HBM2 and GDDR5 will be able to work together in flat, caching/2LM, and hybrid modes. The presence of memory so near to the die would do absolute wonders for certain workloads that require huge data sets and will basically act as an L4 cache.

Intel is focusing on a launch for its Sapphire Rapids Xeon Scalable family in 2022 but a volume ramp is not expected until early 2022.

Which server lineup do you think will offer the best feature set for enterprise markets?

Intel Xeon CPU Families (Preliminary):

Family BrandingCoral RapidsDiamond RapidsClearwater ForestGranite RapidsSierra ForestEmerald RapidsSapphire RapidsIce Lake-SPCooper Lake-SPCascade Lake-SP/APSkylake-SP
Process NodeIntel 14A?Intel 18A-PIntel 18AIntel 3Intel 3Intel 7Intel 710nm+14nm++14nm++14nm+
Platform NameTBDIntel Oak StreamIntel Birch StreamIntel Birch StreamIntel Mountain Stream
Intel Birch Stream
Intel Eagle StreamIntel Eagle StreamIntel WhitleyIntel Cedar IslandIntel PurleyIntel Purley
Core ArchitectureTBDPanther Cove-XDarkmontRedwood CoveSierra GlenRaptor CoveGolden CoveSunny CoveCascade LakeCascade LakeSkylake
MCP (Multi-Chip Package) SKUsYesYesYesYesYesYesYesNoNoYesNo
SocketTBDLGA XXXX / 9324LGA 4710 / 7529LGA 4710 / 7529LGA 4710 / 7529LGA 4677LGA 4677LGA 4189LGA 4189LGA 3647LGA 3647
Max Core CountTBDUp To 192 P-CoresUp To 288Up To 128Up To 288Up To 64?Up To 56Up To 40Up To 28Up To 28Up To 28
Max Thread CountTBDUp To 192Up To 288Up To 256Up To 288Up To 128Up To 112Up To 80Up To 56Up To 56Up To 56
Max L3 CacheTBDTBDTBD480 MB L3108 MB L3320 MB L3105 MB L360 MB L338.5 MB L338.5 MB L338.5 MB L3
Memory SupportTBDUp To 16-Channel DDR5-9000+Up To 12-Channel DDR5-8000Up To 12-Channel DDR5-6400
MCR-8800
Up To 12-Channel DDR5-6400Up To 8-Channel DDR5-5600Up To 8-Channel DDR5-4800Up To 8-Channel DDR4-3200Up To 6-Channel DDR4-3200DDR4-2933 6-ChannelDDR4-2666 6-Channel
PCIe Gen SupportPCIe 6.0PCIe 6.0PCIe 5.0 (96 Lanes)PCIe 5.0 (136 Lanes)PCIe 5.0 (88Lanes)PCIe 5.0 (80 Lanes)PCIe 5.0 (80 lanes)PCIe 4.0 (64 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)
TDP Range (PL1)TBDTBDUp To 500WUp To 500WUp To 350WUp To 350WUp To 350W105-270W150W-250W165W-205W140W-205W
3D Xpoint Optane DIMMTBDTBDN/ADonahue PassN/ACrow PassCrow PassBarlow PassBarlow PassApache PassN/A
CompetitionTBDAMD EPYC VeniceAMD EPYC TurinAMD EPYC TurinAMD EPYC BergamoAMD EPYC Genoa ~5nmAMD EPYC Genoa ~5nmAMD EPYC Milan 7nm+AMD EPYC Rome 7nmAMD EPYC Rome 7nmAMD EPYC Naples 14nm
Launch2028-20292027202620242024202320222021202020182017

News Source: HXL

Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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