Frore Systems, the makers of the AirJet solid-state air-cooling solution, demoed their Liquidjet coldplate, offering up to 1950W TDP cooling on NVIDIA's Rubin GPUs.
Frore Systems AirJet Mini G2 & LiquidJet Coldplate Demoed With New Partner Systems, NVIDIA Rubin 2KW GPUs
Frore Systems aims to break away the thermal barrier with its high-end LiquidJet DLC Coldplate solution, which offers a multistage cooling architecture that incorporates a 3D short-loop jetchannel structure and is customizable to any GPU power map.
The company has previously demonstrated the LiquidJet with the NVIDIA Blackwell Ultra GPU, offering up to 1400W cooling and a 7.7 °C lower operating temperature than traditional liquid cooling solutions for data centers.
At CES, the company showcased three implementations of the LiquidJet, essentially demonstrating its several usecases. The first setup demoed a single reticle solution with a cooling capacity of 600W/cm2 over the GPU Hotspot. The LiquidJet coldplate utilizes the PTM 7950 TIM between the GPU & the cooler. The setup was able to sustain a junction temp of 94.1 °C with the TJmax of the chip at 105 °C.
The second usecase was a single reticle ASIC with a 6x HBM solution rated at 1200W. Here, the core temp. But the most impressive showcase was the NVIDIA Rubin demo, which uses 2 reticle-sized dies with an 8x HBM solution plus the IO interface. The TJmax of the chip was maintained at 80.5 °C with an inlet temp of around 40 °C.
The company has already stated that its LiquidJet coldplate is future-proof and designed for up to 4400-watt class chips, such as NVIDIA's future generation Feynmann GPUs and beyond.
Frore Systems also showed off real partner systems at CES, such as a Qualcomm Snapdragon X2 Elite 2-in-1 notebook and also the reference Mini PC based on the same chip. These were demoed using the AirJet Mini G2 solid-state active cooling chip. Some features of the AirJet Mini G2 include:
- Heat dissipation: 7.5 W (50% increase over AirJet Mini G1)
- Dimensions: just 27mm × 41.5mm × 2.65 mm, supporting ultra-compact devices
- Back pressure: 1,750 Pa (~10× higher than a fan), supporting dustproof, water-resistant
- Noise level: 21 dBA, enabling silent operation
- Design: solid-state, with no moving mechanical parts, delivering long life
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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