50%
Plausible
The Galaxy S27 lineup arriving in early 2027 will be treated to a few watered-down features as Samsung is currently losing its skirmish with the DRAM crisis, along with the rest of the industry. Previously, it was rumored that the base model would need to feature BOE-made OLED panels to keep prices low, and now, the Exynos 2700 powering a percentage of these handsets is going to be missing a key technological feature, despite utilizing Samsung’s newest second-generation 2nm GAA process.
Exynos 2700 may not leverage Samsung’s newest chip packaging, leaving some performance on the table
So far, the biggest cost-cutting decision that the Korean giant is said to make with its Exynos 2700 is the removal of FOWLP (Fan-Out Wafer-Level Packaging) technology, at least according to Sisajournal. Samsung introduced this packaging with the Exynos 2400, and in a nutshell, it allows smartphone chipsets to become small, thinner, and faster by building electrical circuits outside of the SoC’s die area.
This design approach allows for more I/O pins to be added within a smaller footprint, improving heat resistance and, as a result, boosting sustained performance. Given that Samsung’s Exynos range is notorious for overheating and throttling, incorporating this packaging is necessary, even if it increases production costs. Unfortunately, as RAM prices reach ludicrous levels, Samsung is being forced to make some drastic decisions.
While this move can compromise the Exynos 2700’s performance due to excessive heat generation, Samsung can make it up by employing side-by-side (SBS) architecture to help reduce temperatures by placing a heatsink on both the processor and DRAM, with both parts placed side-by-side on the same substrate, hence the name. Since memory chips can reach exceptionally high temperatures, such an implementation would prevent the Exynos 2700 from entering the thermal throttling zone faster.
While Samsung has yet to finalize its decision, any performance loss can potentially mean Samsung’s turnaround in its non-memory business can be compromised, as a previous report mentioned that the Exynos 2700’s capabilities and adoption in the Galaxy S27 series would determine how quickly the manufacturer bounces back.
Then again, there are other ways for Samsung to propel its semiconductor sector, but if removing FOWLP packaging allows the Exynos 2700 to be priced appropriately without sending the Galaxy S27 models out of the consumers’ reach, it’s a trade-off the company needs to make.
News Source: Sisajournal
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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