Samsung’s 2nm GAA process was previously reported to reduce power leakage, allowing the Exynos 2600 to post major efficiency improvements over the A19 Pro in Geekbench 6’s multi-core benchmark. However, even with a lower wattage rating, the chipset was still bound to have higher temperatures without sufficient cooling. Thankfully, Samsung was previously reported to have incorporated its ‘Heat Pass Block’ technology to enable better heat transfer. The same implementation was mentioned at the 23rd International Symposium on Microelectronics Packaging, where a Samsung executive said that the Exynos 2600’s temperatures would reduce by 30 percent.
Lower temperatures mean the Exynos 2600 will have more thermal headroom to maintain its performance with higher CPU and GPU clock speeds
Kim Dae-woo, Senior Vice President and Head of the Package Development Team at Samsung Electronics, said during his speech that “packaging is no longer an end-to-end process, but the starting point of system innovation. The approach is to optimize the entire system, not just the performance of a single chip.” During the Exynos 2600’s internal testing, the chipset was allegedly 14 percent faster than the A19 Pro in multi-core tests, with its GPU being 75 percent faster.
In the latest Geekbench 6 leak, Samsung’s first 2nm GAA SoC matched Apple’s M5 single-core scores, though the word floating around the internet was that these results were not legitimate. Assuming these figures were accurate, it is likely that Samsung’s Heat Pass Block technology aided in keeping the Exynos 2600’s temperatures low, allowing it to sustain higher CPU and GPU clock speeds, resulting in higher benchmark scores.
Why Samsung’s Heat Pass Block technology matters?
For those who do not know, the existing Exynos chipset structure places the DRAM directly on the SoC die. When both components are stressed under an intense workload, it can create an unsustainable amount of heat, contributing to thermal throttling at a faster pace. Heat Pass Block technology functions as a miniature passive heatsink, placed directly on the chipset die to enhance heat dissipation.
On top of the Heat Pass Block, Samsung’s FOWLP, or ‘Fan-out Wafer Level Packaging,’ has also been added to the Exynos 2600 to improve heat resistance and deliver increased multi-core performance, with the 2nm GAA process being the icing on the cake to further boost efficiency. Based on an earlier update, Samsung started the mass production of the Exynos 2600 back in late September, and if you wish to know everything there is to know about the silicon, you can check out our rumor roundup to get yourself up to speed on the company’s plans.
News Source: ETNews
Follow Wccftech on Google to get more of our news coverage in your feeds.
