Dimensity 9400 Rumored To Obtain A 30 Percent Performance Uplift Against Snapdragon 8 Gen 3 In 3DMark While Consuming 40 Percent Less Power

Omar Sohail
Dimensity 9400 effortlessly beats the Snapdragon 8 Gen 3 in 3DMark

MediaTek is gearing up to announce the Dimensity 9400 in October, with the company’s CEO also showing immense confidence in the flagship chipset’s capabilities. Why would he not? A new 3DMark performance rumor claims that the SoC is not just 30 percent faster than the Snapdragon 8 Gen 3 in the same test, but it also consumes 40 percent less power. Then again, it is unfair to compare next-generation silicon to a competitor’s older version, as the real challenge will be how the Dimensity 9400 fares against the Snapdragon 8 Gen 4.

The Dimensity 9400’s rumored feat is impressive because it managed to consume less power while sporting just performance cores

A part of why the Dimensity 9400 may have performed exceptionally that was not pointed out by tipster Digital Chat Station was that the chipset is said to be mass produced on TSMC’s second-generation 3nm process. While employing this technology means that the silicon will be more expensive to manufacture than the Dimensity 9300, the rumor clearly highlights the advantages. Remember that just like its predecessor, the Dimensity 9400 is said to drop any efficiency cores, with its CPU cluster comprising of just performance cores.

Related Story NVIDIA RTX Spark Took Dimensity 9400’s Prime Core And Dimensity 8500’s Performance Cores, And Then Went Wild With Them

Such a configuration means that the Dimensity 9400’s power consumption would have spiked to uncontrollable levels, but MediaTek has apparently managed to tame its top-end chipset. The Snapdragon 8 Gen 4 is also said to ship without any efficiency cores, likely to gain an edge against the competition and MediaTek’s upcoming champion. The Dimensity 9400 was previously rumored to feature the biggest die for a smartphone chipset with 30 billion transistors and a 150mm² measurement. While this approach is costly for MediaTek, it has a boatload of perks.

For instance, a bigger die size allows the manufacturer to add a bigger cache, leading to better performance, and the increased surface results in an even temperature spread, both of which may have contributed to the 3DMark results. Whether or not it becomes an obstruction for MediaTek’s smartphone partners is another tale, but we hope to see these benefits in action. Lastly, while the performance and efficiency uplift against the Snapdragon 8 Gen 3 are impressive to hear, treat this rumor with a pinch of salt until we see the actual results in the coming weeks.

News Source: Digital Chat Station

Omar Sohail Photo

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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