A family of M4 MacBook Pro models is expected on October 28, followed by a MacBook Air lineup next year, meaning that Apple will have its hands full regarding launches. The company should finally have some breathing room in the fourth quarter of next year, with the latest report stating that Apple would have readied the M5 to be used in various products, such as the iPad Pro lineup. Based on the launch of the new SoC, Apple’s newly updated ‘Pro’ tablets could either arrive late next year or in the first half of 2026.
Apart from the M5 upgrade, the new 11-inch and 13-inch iPad Pro will unlikely sport major changes
An update from Bloomberg’s Mark Gurman in the latest ‘Power On’ newsletter mentions the development of the M5, which was previously rumored to have been ongoing since 2023, alongside the A19 Pro. Gurman provides his thoughts on the potential launch of the M5, believing that Apple could announce the new silicon at the end of 2025, and there might even be a chance that the company will unveil the new iPad Pro series during this time.
If you noticed, the Cupertino firm followed a different strategy this year with its premium tablet family, as the 11-inch and 13-inch models were treated to the M4 first, with the new MacBook Pro getting unveiled tomorrow with the SoC. Based on this change alone, we expect the new iPad Pro lineup to flaunt the new silicon, but that could be about the only major change expected from these products. After all, Apple just unveiled the series around six months ago, so it makes little sense to introduce a design overhaul after a short period.
“As for when to expect the next iPad Pro, the company has historically updated that device every 18 months or so. Given that the M5 chip is expected to arrive around the end of next year, it seems likely that the next iPad Pro won’t debut until late 2025 or the first half of 2026. I would count out there being other major changes, since the current design is only six months old.”
We do not believe that Apple will gravitate to TSMC’s 2nm process next year for the M5, as analyst Ming-Chi Kuo had previously predicted that the company will shift to the cutting-edge node in 2026 due to high wafer costs. Fortunately, the M5 will be significantly different from its predecessors as it is reported to adopt TSMC’s Small Outline Integrated Circuit Packaging, or SoIC. This packaging type was first introduced in 2018 and allows the stacking of chips in a three-dimensional structure, resulting in better thermal management, reduced current leakage, and better electrical performance compared to the two-dimensional chip design.
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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