New AMD Ryzen Microcode Update Will Expand Memory Support

May 5, 2017

A new microcode update is on its way to expand Ryzen memory support and enable automated compatibility with 20+ new RAM kits. We initially heard that this microcode update was in the works late last month directly from AMD. Earlier today a Gigabyte spokesperson confirmed via a forum post that the new AGESA 1006 microcode update will add more than 20 new memory registers to enable direct plug and play compatibility with existing Intel compatible DDR4 memory modules.

Early reports from Ryzen users indicated that the best performing DDR4 memory with Ryzen processors feature Samsung’s B die memory chips. G.Skill and GeIL are the biggest suppliers of memory modules featuring these chips. AMD’s technical marketing lead Robert Hallock later confirmed Samsung B die DDR4 memory indeed offers the best out-of-box compatibility with Ryzen processors and the highest overclocking results. He also confirmed that a BIOS update will be rolled out this month to enable out-of-box compatibility with a large collection of Hynix based memory modules.

Ryzen DDR4 Memory Compatibility Guide

Currently your best bet in terms of DDR4 memory is to look for modules with the Samsung B die chips.
Reddit user Wiidesire compiled a terrific list which includes all available models that have these memory chips. Another sure bet is to make sure you purchase a memory kit that’s listed in your motherboard’s memory compatibility list otherwise you may need to input the memory timings yourself for the RAM to run at its advertised speed.

Remember, the advertised speeds of almost all DDR4 memory kits out there are based on the proprietary Intel XMP — Extreme Memory Profile — standard, which is why running your DDR4 memory at its advertised speed can be tricky on Ryzen, especially DDR4 RAM with Hynix memory. In some cases you may need to increase the voltage to 1.5v, which is completely safe, for it to run at its advertised speed. Another easy knob to turn is to slightly up the SOC/unCore voltage to 1.1.

Name	Model number	IC	Rank
G.Skill Trident Z 3000 MHz CL14	F4-3000C14D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Flare X 3200 MHz CL14	F4-3200C14D-16GFX	8Gb Samsung B-Die	Single
G.Skill Trident Z 3200 MHz CL14	F4-3200C14D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Ripjaws V 3200 MHz CL14	F4-3200C14D-16GVK	8Gb Samsung B-Die	Single
G.Skill Trident Z 3200 MHz CL15	F4-3200C15D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Ripjaws V 3200 MHz CL15	F4-3200C15D-16GVK	8Gb Samsung B-Die	Single
G.Skill Trident Z 3466 MHz CL16	F4-3466C16D-16GTZ	8Gb Samsung B-Die	Single
Crucial Elite 3466 MHz CL16	BLE2K8G4D34AEEAK	8Gb Samsung B-Die	Single
G.Skill Trident Z 3600 MHz CL15	F4-3600C15D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Trident Z 3600 MHz CL16	F4-3600C16D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Ripjaws V 3600 MHz CL16	F4-3600C16D-16GVK	8Gb Samsung B-Die	Single
Corsair Vengeance 3600 MHz CL16	CMK32GX4M4B3600C16	8Gb Samsung B-Die	Single
G.Skill Trident Z 3600 MHz CL17	F4-3600C17D-16GTZ	8Gb Samsung B-Die	Single
KFA2 HOF 3600 MHz CL17	HOF4CXLBS3600K17LD162K	8Gb Samsung B-Die	Single
Corsair Vengeance 3600 MHz CL18	CMK32GX4M4B3600C18	8Gb Samsung B-Die	Single
G.Skill Trident Z 3733 MHz CL17	F4-3733C17D-16GTZA	8Gb Samsung B-Die	Single
G.Skill Trident Z 3866 MHz CL18	F4-3866C18D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Trident Z 4000 MHz CL18	F4-4000C18D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Trident Z 4000 MHz CL19	F4-4000C19D-16GTZ	8Gb Samsung B-Die	Single
G.Skill Trident Z 4133 MHz CL19	F4-4133C19D-16GTZA	8Gb Samsung B-Die	Single
G.Skill Trident Z 4266 MHz CL19	F4-4266C19D-16GTZ	8Gb Samsung B-Die	Single

The Gigabyte spokesperson also confirmed that a new BIOS update for Gigabyte motherboards will be coming out to address the cold boot or “soft brick” issue that could result from BIOS file corruption. The update will also include support for manually disabling LAN, audio and specific PCIe slots. There’s no set date for the update but you can expect it to come out some time later this month.